UWZ1V330MCL1GS

The UWZ1V330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UWZ series designed for surface-mount assembly and operation across a wide temperature range. It delivers 33 µF at 35 V with a compact SMD can footprint and is intended for applications that require reliable performance through harsh thermal cycles and automated placement.

Key value propositions include AEC‑Q200 qualification for stringent reliability requirements, RoHS compliance, and compatibility with high-temperature reflow processes up to a 260°C peak, enabling integration into modern automotive and industrial production flows.

Key Features

• Electrical Performance — 33 µF nominal capacitance with ±20% tolerance (measured at 120 Hz, 20°C). Rated voltage: 35 V. Leakage current after 2 minutes is ≤ 0.01CV or 3 µA (whichever is greater).
• Frequency and Loss Characteristics — Ripple current: 59 mA at 120 Hz and 88.5 mA at 10 kHz. Tangent of loss angle (tan δ) for 35 V parts is specified up to 0.14 at 120 Hz, 20°C.
• Mechanical / Package — Chip-type, surface-mount radial can (SMD) in a compact L: 6.2 × D: 8 mm footprint; suitable for automatic mounting with carrier tape.
• Thermal and Reflow — Operating temperature range: –55°C to +105°C. Compatible with high-temperature reflow: recommended peak 260°C (example condition: 260°C peak 5 s; 230°C over 60 s, two passes for certain sizes).
• Reliability & Lifetime — Endurance: 1000 hours at 105°C with specified limits on capacitance change (within ±20% for rated voltages ≥20 V) and leakage. Resistance to soldering heat tested at 250°C for 30 s with limited capacitance and loss variation.
• Compliance & Qualification — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suited for automotive subsystems that require AEC‑Q200 qualification and wide temperature operation (–55°C to +105°C).
• Surface-Mount Power Assemblies — Designed for automated placement and SMD assembly lines, including those using high-temperature reflow processes.
• Power Supply Filtering and Decoupling — Provides bulk capacitance and ripple handling for compact power modules and regulators in constrained PCB areas.

Unique Advantages

• AEC‑Q200 Qualification: Meets automotive-grade reliability requirements for demanding applications.
• High-Temperature Reflow Compatibility: Rated for 260°C peak reflow conditions, enabling use with modern Pb‑free assembly processes.
• Wide Operating Temperature: –55°C to +105°C range supports designs exposed to extreme thermal environments.
• Long-Term Endurance: 1000 hours at 105°C endurance rating provides predictable long-term behavior under elevated temperature stress.
• Compact SMD Can: 6.2 × 8 mm footprint offers bulk capacitance in a small surface-mount package suitable for automated assembly.
• Controlled Loss and Leakage: Specified tan δ and low leakage current enable stable performance in filtering and energy-storage roles.

Why Choose UWZ1V330MCL1GS?

The UWZ1V330MCL1GS combines automotive-grade qualification, wide temperature capability, and high-temperature reflow compatibility in a compact SMD aluminum electrolytic package. Its specified ripple current, low leakage, and endurance at 105°C make it appropriate for engineers designing robust power and filtering circuits for automotive and industrial environments.

This part is well suited to teams that require dependable, measurable capacitor behavior under thermal stress and automated assembly conditions, offering a balance of size, performance, and qualification from the Nichicon UWZ series.

If you would like pricing, availability, or technical clarification for UWZ1V330MCL1GS, request a quote or contact sales to discuss lead times and ordering options.