UWZ1V331MCL1GS
| Part Description |
330 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,964 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 330 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 450 mA @ 10 kHz | Ripple Current Low Frequency | 300 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UWZ1V331MCL1GS – Aluminum Electrolytic SMD Capacitor, 35 V, 330 μF
The UWZ1V331MCL1GS is a chip-type aluminum electrolytic surface-mount capacitor designed for robust power decoupling and energy storage in demanding environments. It combines a compact radial can SMD package with a high-capacitance 330 μF, 35 V rating and polarized construction for board-level power applications.
Engineered for wide temperature operation and rugged assembly, this part supports –55°C to +105°C operation, AEC-Q200 qualification, RoHS compliance, and compatibility with high-temperature reflow processes up to a 260°C peak for automated surface-mount production.
Key Features
- Capacitance & Voltage: 330 μF nominal capacitance at a 35 V rating with ±20% tolerance, providing stable bulk energy storage for power rails and decoupling.
- Chip SMD Package: Radial, can-style SMD package suitable for automated mounting by carrier tape; nominal size L: 1 × D: 1 cm with surface-mount land size 1.03 × 1.03 cm.
- Wide Temperature Range: Rated for –55°C to +105°C operation, enabling use across industrial and automotive temperature environments.
- High-temperature Reflow Compatibility: Compatible with 260°C peak reflow soldering. Recommended reflow condition: 260°C peak 5 s; 230°C over 60 s two times (φ8 × 6.2, φ10 × 10: 1 time), allowing integration into lead-free SMT assembly flows.
- Reliability & Lifetime: Endurance rated for 1000 hours at 105°C with defined limits on capacitance change (within ±20% for rated voltages ≥20 V), tan δ and leakage current retention.
- Ripple & Leakage Characteristics: Ripple current: 300 mA at 120 Hz and 450 mA at 10 kHz. Leakage current after 2 minutes at 20°C is ≤ 0.01CV or 3 μA (whichever is greater), supporting stable performance in power applications.
- Low-temperature Performance & Loss: Tan δ (max.) at 120 Hz, 20°C is 0.14 for 35 V parts; impedance ratios for low-temperature stability include Z(–25°C)/Z(+20°C) = 2 and Z(–40°C)/Z(+20°C) = 3 for 35 V rating.
- Standards Compliance: AEC-Q200 Qualified and RoHS compliant (2011/65/EU.(EU)2015/863), suitable for designs requiring recognized quality and environmental compliance.
Typical Applications
- Automotive Electronics: Bulk filtering and energy storage in in-vehicle power systems and modules that require AEC-Q200 qualification and –55°C to +105°C operation.
- Power Supply Filtering: Smoothing and decoupling for DC–DC converters and voltage regulators where 330 μF at 35 V and defined ripple current capability improve transient response.
- Industrial Controls: Power buffering and noise suppression in industrial control units and power modules exposed to wide temperature ranges and long operating lifetimes.
- Automated SMT Production Lines: Designed for carrier-tape feeding and high-temperature reflow assembly, simplifying integration into automated manufacturing processes.
Unique Advantages
- Automated Assembly Ready: Carrier-tape compatibility and 260°C peak reflow support enable straightforward integration into lead-free SMT production lines.
- Automotive-grade Reliability: AEC-Q200 qualification and 1000-hour endurance at 105°C provide documented performance for automotive and similarly demanding applications.
- High Capacitance in Compact SMD Form: 330 μF in a 1 × 1 cm footprint delivers substantial bulk capacitance for constrained board space.
- Wide Operating Temperature: –55°C to +105°C range supports deployment across harsh thermal environments without loss of functionality.
- Measured AC & Low-temperature Characteristics: Specified tan δ, impedance ratios, and ripple current ratings give engineers the data needed to size the capacitor confidently for transient and frequency-dependent behavior.
- Proven Soldering Robustness: Resistance-to-soldering-heat and hot-plate test criteria ensure retained electrical characteristics after standard assembly processes.
Why Choose UWZ1V331MCL1GS?
The UWZ1V331MCL1GS offers a combination of high capacitance, compact SMD packaging, and documented reliability that suits power-dense designs requiring automated assembly and wide temperature performance. Its AEC-Q200 qualification and RoHS compliance make it appropriate for automotive and industrial contexts where traceable endurance and environmental compliance are required.
Engineers specifying this part gain detailed electrical and thermal characteristics—ripple current, leakage limits, tan δ, and low-temperature impedance ratios—backed by a 1000-hour endurance rating at 105°C, allowing confident selection for long-life power filtering and energy storage applications.
To request a quote or submit a technical inquiry for UWZ1V331MCL1GS, please contact our sales team or request a formal quotation with your project details and required quantities.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016