UWZ1V470MCL1GS

The UWZ1V470MCL1GS is a chip-type aluminum electrolytic capacitor in the Nichicon UWZ series designed for surface-mount assembly. It provides 47 µF capacitance at a 35 V rating with a compact φ6.3 × 5.8 mm can-style SMD package and embossed carrier taping for automated placement.

This part targets applications requiring a wide operating temperature range (–55°C to +105°C), AEC-Q200 qualification, and endurance of 1000 hours at 105°C, delivering predictable performance for demanding electronic assemblies.

Key Features

• Capacitance and tolerance — 47 µF nominal capacitance with tolerance of -20% to +20% (±20% at 120 Hz, 20°C).
• Voltage rating — Rated for 35 V operation.
• Loss tangent (tan δ) — tanδ of 0.14 measured at 20°C, 120 Hz, supporting stable impedance characteristics under specified conditions.
• Ripple current capability — Low-frequency ripple current 63 mA (120 Hz) and high-frequency ripple current 94.5 mA (10 kHz) for handling AC components in power circuits.
• Leakage current — Specified leakage current 16.45 µA.
• Wide temperature range and endurance — Operating from –55°C to +105°C with endurance rated at 1000 hours at 105°C.
• Assembly-ready package — Chip-type, radial can SMD package (φ6.3 × 5.8 mm) supplied in embossed carrier taping compatible with automatic mounting machines.
• Reliability and compliance — AEC-Q200 qualified and RoHS-compliant per the product data.
• High-temperature reflow compatibility — Designed to withstand recommended reflow conditions up to a 260°C peak for reliable soldering during assembly.

Typical Applications

• Automotive electronics — Intended for use in automotive electronic systems where AEC-Q200 qualification and a –55°C to +105°C operating range are required.
• Surface-mount production — Chip-type, embossed-tape packaging supports automatic placement and high-volume PCB assembly.
• RoHS-compliant designs — Suitable for products requiring lead-free, RoHS-compliant components.

Unique Advantages

• Temperature-resilient performance — Rated for –55°C to +105°C with 1000-hour endurance at 105°C, enabling use in environments with wide thermal swings.
• Automotive-grade qualification — AEC-Q200 rating supports deployment in applications with formal automotive reliability requirements.
• Compact SMD can package — φ6.3 × 5.8 mm chip-type can minimizes board space while providing axial-style capacitor performance in an SMD form.
• Assembly efficiency — Embossed carrier taping and compatibility with automatic mounting machines reduce handling time and support high-throughput production.
• Predictable ripple handling — Specified low- and high-frequency ripple current values (63 mA at 120 Hz and 94.5 mA at 10 kHz) allow straightforward power-design margining.
• Compliance and manufacturability — RoHS compliance and high-temperature reflow tolerance simplify integration into lead-free manufacturing flows.

Why Choose UWZ1V470MCL1GS?

UWZ1V470MCL1GS combines a compact chip-type SMD can package with AEC-Q200 qualification and a wide operating temperature range, making it suitable for designs that require robust, reliable capacitive performance in challenging environments. Its specified ripple currents, low loss tangent, and controlled leakage current provide engineers with verifiable electrical characteristics for power and decoupling duties.

This part is ideal for teams building automotive-grade and industrial electronics where automated assembly, RoHS compliance, and long-term endurance at elevated temperatures are priorities. Selecting UWZ1V470MCL1GS supports consistent manufacturing and predictable field performance backed by series-level specifications.

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