UZG0J101MCL1GB

The UZG0J101MCL1GB is an aluminum electrolytic chip-type capacitor designed for surface mounting on high-density printed circuit boards. It delivers 100 µF capacitance at a 6.3 V rating with polarized construction and is built for applications that require wide operating temperature range and qualification to automotive-grade reliability standards.

Targeted for demanding environments, this RoHS‑compliant, AEC‑Q200 qualified capacitor supports long-term operation at elevated temperature and is compatible with automated assembly using carrier tape.

Key Features

• Electrical performance — 100 µF rated capacitance at 6.3 V with ±20% tolerance and polarized construction for power smoothing and decoupling on board-level power rails.
• Wide temperature and endurance — Operates from −40 °C to +105 °C and meets endurance criteria of 1000 hours at 105 °C as specified in the product datasheet.
• Automotive qualification and environmental compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated industry and automotive electronics requirements.
• Surface-mount, machine-assembly friendly — Chip-type SMD (radial, can) package designed for high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
• Ripple handling — Rated ripple currents of 52 mA at 120 Hz and 78 mA at 10 kHz with published frequency coefficients to scale ripple performance across frequencies.
• Leakage and dissipation characteristics — Leakage current specified as not more than 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C; tan δ limits defined in the datasheet for 120 Hz, 20 °C.
• Compact footprint — Designed for small SMD footprints with a specified surface mount land size to simplify PCB layout for dense assemblies.

Typical Applications

• Automotive electronic modules — Suited for electronic control units and modules that require components qualified to AEC‑Q200 and capable of extended operation at elevated temperatures.
• High-density SMD assemblies — Ideal for compact, surface-mounted designs where automated tape-fed placement and small footprint are important.
• Power supply decoupling and filtering — Used for smoothing and decoupling on board power rails where wide temperature range and defined ripple current capability are required.

Unique Advantages

• Automotive-grade qualification: AEC‑Q200 qualification provides documented reliability for automotive and other rigorous applications.
• Wide operating temperature: −40 °C to +105 °C rating supports use across harsh ambient conditions.
• Long high-temperature lifetime: 1000 hours at 105 °C endurance rating demonstrates sustained performance under thermal stress.
• Assembly-ready SMD form factor: Chip-type package designed for carrier‑tape automated mounting reduces BOM complexity and speeds production.
• Regulatory compliance: RoHS compliant to 2011/65/EU and (EU)2015/863 requirements for material restrictions.
• Measured ripple and leakage specs: Defined ripple current values and leakage current limits allow predictable board-level power design and verification.

Why Choose UZG0J101MCL1GB?

The UZG0J101MCL1GB balances compact SMD packaging with automotive-grade reliability and clear electrical specifications, making it a practical choice for designers of high-density PCB assemblies and electronic modules that operate across a wide temperature range. Its qualification to AEC‑Q200, RoHS compliance, and specified endurance at elevated temperature deliver verifiable long-term robustness for regulated and industrial applications.

This part is well suited to engineers and procurement teams looking for a predictable, assembly-friendly electrolytic capacitor for power filtering and decoupling where qualification and thermal endurance are required.

If you would like a quote, technical pricing, or availability information for UZG0J101MCL1GB, please request a quote or contact sales to submit your inquiry.