UZG0J470MCL1GB

The UZG0J470MCL1GB is a chip-type aluminum electrolytic capacitor optimized for surface-mount assembly on high-density printed circuit boards. It delivers 47 µF capacitance at a 6.3 V rating in a compact can-style SMD package.

Designed for demanding environments, this RoHS-compliant capacitor operates over a wide temperature range (−40 °C to +105 °C) and is AEC-Q200 Qualified, making it suitable for automotive and other reliability-focused applications where automated assembly and space savings are important.

Key Features

• Capacitance & Voltage: 47 µF rated capacitance at 6.3 V with ±20% tolerance, suitable for low-voltage decoupling and bulk storage in compact designs.
• Low-profile chip package: Chip-type aluminum electrolytic in a compact radial can SMD form; nominal dimensions L: 3.9 × D: 5 mm and surface-mount land size L: 5.3 × W: 5.3 mm.
• Wide operating temperature: Guaranteed operation from −40 °C to +105 °C to support thermally challenging environments.
• Automotive-grade qualification: AEC-Q200 Qualified for designs that require recognized reliability standards for automotive electronics.
• Endurance at elevated temperature: Rated for 1000 hours at 105 °C; endurance characteristics include capacitance change within ±30% after the test period when restored to 20 °C.
• Ripple current capability: Specified ripple current of 32 mA at 120 Hz and 48 mA at 10 kHz; frequency coefficients available for other frequencies per the series specification.
• Assembly-friendly: Designed for surface mounting on high-density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Regulatory compliance: Compliant with the RoHS directive (2011/65/EU,(EU)2015/863).

Typical Applications

• Automotive electronics: AEC-Q200 qualification and wide temperature rating make this capacitor suitable for automotive ECU and electronic modules that require reliable electrolytic bulk capacitance.
• High-density PCB power decoupling: Low-profile chip package enables placement on compact, space-constrained boards for local power smoothing and decoupling.
• Automated assembly lines: Carrier-tape compatibility supports high-volume manufacturing using automatic surface-mount placement equipment.

Unique Advantages

• Space-efficient package: Compact chip-type can and small land pattern help reduce board area while providing 47 µF of capacitance.
• Designed for harsh environments: −40 °C to +105 °C operating range and 1000-hour endurance at 105 °C deliver predictable performance under elevated-temperature stress.
• Measurable ripple performance: Specified ripple currents at 120 Hz (32 mA) and 10 kHz (48 mA) with frequency coefficients available to size for application-specific switching frequencies.
• Reliable for automotive programs: AEC-Q200 qualification aligns the component with automotive-quality design and validation requirements.
• Production-ready packaging: Carrier-tape compatibility and SMD package form factor streamline automated placement and reduce assembly time.
• Compliance and material assurance: RoHS compliance provides regulatory confidence for global product designs.

Why Choose UZG0J470MCL1GB?

UZG0J470MCL1GB combines compact, chip-type packaging with automotive-level qualification and a wide operating temperature window to address space-constrained, reliability-driven power designs. Its specified ripple current performance and 1000-hour endurance at 105 °C provide verifiable characteristics for engineers balancing thermal stress and capacitance needs.

This capacitor is well suited for teams designing automotive modules, compact power supplies, and other high-density electronic assemblies that require SMD-compatible electrolytic bulk capacitance with defined endurance and regulatory compliance.

Request a quote or submit a pricing inquiry to receive availability, lead-time, and ordering information for UZG0J470MCL1GB.