UZG1A330MCL1GB

The UZG1A330MCL1GB is a chip-style aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It provides a compact 33 µF, 10 V polarized solution in a radial can SMD package optimized for automated placement and carrier-tape feeding.

Engineered for demanding operating conditions, this part supports automotive electronics and other applications that require AEC-Q200 qualification, RoHS compliance, wide temperature operation from −40 °C to +105 °C, and demonstrated endurance under elevated temperature stress.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance rated at 10 V with ±20% tolerance at 120 Hz, 20 °C.
• Compact SMD Package — Chip-style radial can SMD in a 3.9 × 5.0 mm (L × D) case; surface mount land size 5.3 × 5.3 mm for high-density PCB layouts.
• Wide Temperature Range — Operates from −40 °C to +105 °C to support thermally demanding environments.
• AEC-Q200 Qualified — Qualified for automotive-grade reliability; suitable for designs where AEC-Q200 qualification is required.
• Endurance — Rated for 1000 hours at 105 °C with specified limits on capacitance change, tan δ and leakage current after test.
• Electrical Characteristics — Low leakage current (≤ 0.01 CV or 3 µA after 2 minutes at 20 °C), tan δ (max. 0.32 at 10 V, 120 Hz, 20 °C), and defined low-temperature impedance ratios for stable performance down to −40 °C.
• Ripple Handling — Rated ripple current characteristics include approximately 30 mA at 120 Hz and 45 mA at 10 kHz, with frequency coefficients provided for different operating frequencies.
• Assembly Ready — Chip form factor designed for automatic mounting machines using carrier tape to simplify high-volume PCB assembly.
• RoHS Compliant — Conforms to RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Power decoupling and local energy storage on control modules and electronic units where AEC-Q200 qualification and wide temperature operation are required.
• High-Density PCB Designs — Compact SMD chip package for power rail smoothing and bulk decoupling in space-constrained board layouts.
• Sensor and Module Power — Local filtering and transient suppression for compact sensor interfaces and electronic assemblies requiring reliable, polarized capacitance.

Unique Advantages

• AEC-Q200 Qualified Reliability: Meets automotive-grade qualification to support designs requiring established reliability standards.
• Small Footprint for Dense Boards: 3.9 × 5.0 mm package and 5.3 × 5.3 mm land pattern enable tight placement on high-density PCBs.
• Wide Operating Temperature: −40 °C to +105 °C rating supports deployment across broad environmental ranges.
• Automated Assembly Compatibility: Carrier-tape feed capability streamlines automated placement and high-volume manufacturing.
• Proven Endurance: 1000 hours at 105 °C specification provides a documented thermal endurance baseline for long-term operation.
• Controlled Electrical Performance: Defined limits for leakage current, tan δ, and impedance behavior at low temperature help ensure predictable performance in system designs.

Why Choose UZG1A330MCL1GB?

The UZG1A330MCL1GB combines compact SMD packaging with automotive-grade qualification and a wide −40 °C to +105 °C operating range to deliver reliable capacitance in space-constrained, assembly-intensive designs. Its documented endurance, controlled leakage, and ripple characteristics make it a practical choice for engineers specifying components for automotive electronics and other demanding embedded applications.

This part is particularly well suited for designs that need a verified, surface-mount polarized capacitor with carrier-tape compatibility for automated production, and where long-term thermal endurance and AEC-Q200 qualification add confidence to system reliability.

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