UZG1C220MCL1GB

The UZG1C220MCL1GB is a chip‑type aluminum electrolytic capacitor from Nichicon's UZG series, providing 22 µF at 16 V in a compact surface‑mount package. Engineered for high‑density PC boards and automated assembly, it combines a low profile with automotive-grade qualification and wide operating temperature capability.

Key value propositions include AEC‑Q200 qualification, RoHS compliance, and robust electrical performance across –40 to +105 °C, making it suitable for demanding environments where space, reliability, and automated production are priorities.

Key Features

• Capacitance & Voltage: 22 µF rated capacitance at 16 V with ±20% tolerance (120 Hz, 20 °C).
• Temperature Range & Endurance: Operating range –40 to +105 °C with endurance specified as 1000 hours at 105 °C.
• Package & Mounting: Chip‑type SMD radial can; case dimensions L: 3.9 × D: 5 mm and surface mount land size L: 5.3 × W: 5.3 mm. Designed for surface mounting on high‑density PC boards.
• Automated Assembly Compatibility: Applicable to automatic mounting machines fed with carrier tape for reliable pick‑and‑place production.
• Reliability & Compliance: AEC‑Q200 Qualified and RoHS compliant (2011/65/EU,(EU)2015/863), supporting regulated and automotive applications.
• Ripple Current & Frequency Response: Rated ripple current 26 mA at 120 Hz and 39 mA at 10 kHz; frequency coefficient of rated ripple current increases up to 1.50 at 10 kHz or more, enabling predictable behavior across frequencies.
• Dissipation Factor (tan δ): Specified tan δ applicable to the rated voltage class (0.20 max. for 16 V at 120 Hz, 20 °C) for predictable AC loss characteristics.

Typical Applications

• Automotive electronics: Suited for automotive modules that require AEC‑Q200 qualification and wide temperature operation (–40 to +105 °C).
• High‑density surface‑mount PCBs: Compact chip package designed for space‑constrained boards where surface‑mount integration is required.
• Automated assembly production: Carrier‑tape compatibility enables efficient pick‑and‑place assembly in volume manufacturing.

Unique Advantages

• AEC‑Q200 qualified for automotive use: Provides a documented qualification pathway for automotive system designers requiring industry standard reliability.
• Wide operating temperature and endurance: –40 to +105 °C rating with 1000 hours endurance at 105 °C supports long‑life operation in harsh environments.
• Compact, low‑profile SMD form factor: Small footprint (3.9 × 5 mm) and chip‑type construction simplify board layout in high‑density designs.
• Designed for automated production: Carrier‑tape feed compatibility reduces assembly handling and supports high throughput manufacturing.
• Predictable ripple performance: Specified ripple current values and frequency coefficients allow designers to size capacitors for frequency‑dependent loads.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose UZG1C220MCL1GB?

UZG1C220MCL1GB delivers a balanced combination of compact SMD packaging, automotive qualification, and electrical performance for designers targeting high‑density, reliability‑sensitive applications. Its 22 µF/16 V rating, controlled dissipation factor, and frequency‑aware ripple capability make it a dependable choice where predictable decoupling and filtering are required across a wide temperature range.

Manufactured by Nichicon as part of the UZG family, this part is positioned for customers needing AEC‑Q200 qualification, RoHS compliance, and production‑friendly packaging for automated assembly. The specified endurance and thermal range support long‑term deployment in demanding environments.

Request a quote or contact sales to discuss pricing, availability, and how UZG1C220MCL1GB can fit into your next production design.