UZG1A470MCL1GB

The UZG1A470MCL1GB is a chip-style aluminum electrolytic capacitor from Nichicon's UZG series designed for surface-mount, high‑density PCB applications. It provides 47 µF capacitance at a 10 V rating with polarized construction and a nominal tolerance of ±20%.

Built for demanding environments, this part supports a wide operating temperature range and long-term endurance, and is AEC‑Q200 qualified with RoHS compliance—making it suitable for automotive electronics and other reliability‑focused designs.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance at a 10 V rated voltage with polarization and ±20% tolerance for decoupling and bulk‑storage use.
• Surface-mount Chip Package — Chip-style, radial can SMD package engineered for high‑density PC boards and compatibility with automated carrier‑tape pick‑and‑place assembly.
• Wide Temperature Range — Rated for operation from −40 °C to +105 °C for use across harsh temperature environments.
• Automotive-Grade Qualification — AEC‑Q200 qualified, meeting qualification requirements for automotive electronic applications.
• Endurance & Reliability — Specified for 1000 hours at 105 °C with defined limits on capacitance change, tan δ and leakage current after endurance testing.
• Ripple Current & Frequency Response — Rated ripple current parameters: 40 mA at 120 Hz and 60 mA at 10 kHz; frequency coefficient data available for application‑level ripple scaling.
• Leakage Current Specification — Leakage current after 2 minutes at rated voltage is ≤ 0.01 CV or 3 µA (whichever is greater), providing predictable standby performance.
• Assembly Footprint — Compact case size (3.9 × 6.3 mm) and recommended PCB land pattern of 6.6 × 6.6 mm to simplify layout for automated assembly.
• Environmental Compliance — Compliant with RoHS (2011/65/EU and (EU)2015/863) requirements.

Typical Applications

• Automotive electronic modules — Power decoupling and smoothing on control units and body electronics where AEC‑Q200 qualification and wide temperature range are required.
• High-density PCB designs — Compact chip form factor and SMD compatibility for space-constrained boards in consumer and industrial electronics.
• Power filtering for sensors and control circuits — Local energy storage and ripple suppression for sensor front-ends and low-voltage power rails.

Unique Advantages

• AEC‑Q200 Qualified Reliability — Meets automotive qualification standards for designers requiring proven component-level reliability.
• Wide Operating Temperature Window — −40 °C to +105 °C rating supports use across extreme ambient conditions without derating the device selection.
• Compact SMD Form Factor — Chip-type SMD package and small case size reduce board area usage and enable higher component density.
• Assembly-friendly — Designed for carrier tape feeding and automated placement to streamline high-volume manufacturing processes.
• Predictable Ripple Handling — Published ripple current ratings (40 mA @120 Hz, 60 mA @10 kHz) and frequency coefficients enable accurate thermal and performance budgeting.
• Controlled Leakage and Endurance — Defined leakage current limits and 1000‑hour endurance at 105 °C for long-term performance stability.

Why Choose UZG1A470MCL1GB?

UZG1A470MCL1GB combines a compact chip SMD package with automotive‑grade qualification and a wide operating temperature range, making it a strong choice for designers who need reliable decoupling and bulk capacitance in space‑constrained, high‑density assemblies. Its defined endurance, leakage and ripple current specifications make system‑level behavior predictable for thermal and lifetime planning.

This capacitor is well suited to engineers and procurement teams specifying components for automotive electronics, industrial controls, and compact power subsystems that require RoHS compliance, AEC‑Q200 qualification, and automated assembly readiness.

Request a quote or contact sales to check availability, lead times and to discuss application-specific requirements for UZG1A470MCL1GB.