UZG1C330MCL1GB

The UZG1C330MCL1GB is a chip-style aluminum electrolytic capacitor in Nichicon’s UZG series, offering 33 µF capacitance at a 16 V rating in a compact surface-mount can package. It is designed for high-density PC board assemblies and automated tape-and-reel placement.

With an operating temperature range of −40 °C to +105 °C, AEC-Q200 qualification, and RoHS compliance, this capacitor targets applications that require a robust, low-profile SMD electrolytic solution with defined ripple and lifetime characteristics.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance with a 16 V rated voltage and ±20% tolerance at 120 Hz, 20 °C.
• Low-profile SMD Package — Chip-type radial can for surface mounting; part dimensions L: 3.9 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm for high-density boards.
• Wide Temperature Range — Rated for operation from −40 °C to +105 °C, suitable for thermally demanding environments.
• Automotive-Grade Reliability — AEC-Q200 qualified with an endurance rating of 1000 hours at 105 °C (capacitance change within ±30%, tan δ ≤ 300% of initial, leakage current ≤ initial spec).
• Leakage Current Specification — After 2 minutes’ application of rated voltage at 20 °C, leakage current is not more than 0.01 CV or 3 µA, whichever is greater.
• Ripple Current & Frequency Response — Ripple current ratings include 35 mA at 120 Hz and 52.5 mA at 10 kHz; frequency coefficient data is provided for system-level ripple evaluation.
• Assembly Compatibility — Designed for surface mounting on high-density PCBs and compatible with automatic mounting machines fed with carrier tape.
• Environmental Compliance — Compliant with RoHS directives (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suitable for compact on-board modules where an AEC-Q200–qualified SMD electrolytic capacitor is required for filtering and bulk storage under automotive temperature extremes.
• High-density power circuits — Used on tightly packed PCBs to provide local energy storage and ripple handling where low-profile SMD components are needed.
• Industrial control modules — Fits automated assembly lines and supports long-term operation in control electronics operating across wide temperature ranges.

Unique Advantages

• Low-profile SMD form factor: Compact L: 3.9 × D: 6.3 mm footprint lets designers save board space while keeping required capacitance on-board.
• AEC-Q200 qualification: Provides documented reliability for applications that require automotive-grade component screening.
• Wide operating temperature and proven endurance: −40 °C to +105 °C rating with 1000 hours endurance at 105 °C supports demanding thermal environments and life-cycle expectations.
• Defined leakage and ripple performance: Explicit leakage current limits and ripple current ratings simplify power budgeting and thermal planning.
• Automated assembly ready: Designed for tape-fed placement machines, streamlining high-volume production and reducing handling complexity.
• RoHS compliant: Meets current environmental substance restrictions for regulatory and sourcing consistency.

Why Choose UZG1C330MCL1GB?

The UZG1C330MCL1GB positions itself as a compact, automotive-grade SMD electrolytic capacitor for designs that require reliable capacitance in constrained PCB real estate. Its combination of AEC-Q200 qualification, wide temperature operation, and defined endurance and leakage characteristics make it appropriate for engineers specifying components for long-life assemblies.

This part is particularly well suited to designers and procurement teams seeking a RoHS-compliant, tape-and-reel compatible capacitor with clearly defined ripple and lifetime data for use in automotive and industrial SMD power and control applications.

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