UZG1E330MCL1GB

The UZG1E330MCL1GB is a chip-type aluminum electrolytic capacitor in a compact SMD can package, rated at 33 µF and 25 V. It is designed for surface mounting on high-density printed circuit boards and is suitable for automated assembly using carrier tape.

Engineered for extended temperature operation and reliability, this part addresses applications that require robust electrolytic capacitance in confined PCB real estate with verifiable electrical performance and industry qualifications.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance (120 Hz, 20°C).
• Chip-type SMD Package — Radial, can-style SMD construction optimized for high-density PCBs and surface-mount assembly.
• Wide Temperature Range — Rated for operation from −40°C to +105°C to support demanding environmental conditions.
• Automotive Grade — AEC-Q200 qualified, enabling use in applications that require that industry qualification.
• Endurance — Specified for 1000 hours at 105°C with defined limits for capacitance change, tan δ and leakage current.
• Ripple Current Performance — Rated ripple current: 42 mA at 120 Hz and 63 mA at 10 kHz for this part; frequency coefficients apply across other frequencies (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or more).
• Low Leakage Current — After 2 minutes’ application of rated voltage at 20°C, leakage current is specified as not more than 0.01 CV or 3 µA, whichever is greater.
• RoHS Compliant — Manufactured in compliance with the RoHS directive (2011/65/EU, (EU)2015/863).
• Assembly-friendly — Compatible with automatic mounting machines fed with carrier tape; case top marked with black print for polarity/identification.

Typical Applications

• Automotive Electronics — Suited for electronic modules that require AEC-Q200 qualification and wide temperature endurance from −40°C to +105°C.
• High-Density PCBs — Designed for surface mounting in space-constrained board layouts where a compact SMD electrolytic is needed.
• Automated Assembly — Compatible with carrier-tape feed for high-volume pick-and-place manufacturing.

Unique Advantages

• AEC-Q200 Qualification — Enables specification in designs that demand automotive-grade component qualification.
• Wide Operating Temperature — −40°C to +105°C rating supports use across harsh and variable environments.
• Compact SMD Form Factor — Chip-type can package conserves PCB area while delivering electrolytic capacitance.
• Proven Endurance — 1000 hours at 105°C endurance rating provides a measurable reliability baseline for thermal stress.
• Measured Electrical Limits — Defined leakage current and tan δ specifications allow predictable behavior in design margins.
• Manufacturing Compatibility — Carrier-tape compatibility and clear top marking simplify automated assembly and inspection.

Why Choose UZG1E330MCL1GB?

The UZG1E330MCL1GB combines a compact, chip-type SMD can with engineering-grade specifications—33 µF at 25 V, AEC-Q200 qualification, wide temperature range, and defined endurance and leakage limits—making it a reliable choice for designers needing electrolytic capacitance in space-constrained, production-oriented applications. Its assembly-friendly packaging and RoHS compliance further ease integration into modern manufacturing flows.

This part is well suited for engineering teams specifying components for automotive and industrial boards where qualification, thermal endurance and predictable electrical performance are required, delivering a balance of size, manufacturability and documented reliability.

Please request a quote or submit an inquiry for pricing, availability and lead-time details to proceed with procurement or design evaluation.