UZG1H100MCL1GB

The UZG1H100MCL1GB is a chip-type aluminum electrolytic capacitor in a compact surface-mount can designed for high-density PCBs. It delivers 10 µF capacitance at 50 V with polarized construction and is optimized for automated tape-fed assembly.

Targeted for automotive and other demanding embedded applications, the UZG series combines wide operating temperature range, AEC-Q200 qualification, and long-term endurance for stable power decoupling and smoothing across harsh environments.

Key Features

• Electrical Performance — 10 µF nominal capacitance with ±20% tolerance at 120 Hz, 20°C; polarized design for DC smoothing and decoupling.
• Rated Voltage — 50 V rated voltage suitable for mid-voltage power rails and converter outputs.
• Temperature & Endurance — Rated for –40°C to +105°C operation with endurance of 1000 hours at 105°C (capacitance change within ±30%, leakage current ≤ initial specified value).
• Low-profile Chip Package — Compact chip-type can with L: 3.9 × D: 6.3 mm body size and surface-mount land size 6.6 × 6.6 mm, enabling high-density PCB layouts and automated placement.
• Assembly Compatibility — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), with controlled leakage current (≤ 0.01·C·V or 3 μA after 2 minutes at 20°C).
• Ripple and Frequency Behavior — Rated ripple current examples: 26 mA at 120 Hz and 39 mA at 10 kHz; frequency coefficient available for scaling ripple capability across 50 Hz to ≥10 kHz.
• Performance After Soldering — Meets characteristic requirements after resistance-to-soldering-heat test (30 s at 250°C hot plate), ensuring robustness to soldering processes.

Typical Applications

• Automotive power modules — For DC link smoothing and decoupling in automotive electronics where AEC-Q200 qualification and wide temperature range are required.
• DC–DC converter outputs — Provides compact output filtering for converters and regulation stages at mid-level voltages.
• Sensor and MCU power stabilization — Local energy storage and transient suppression for sensors, microcontrollers, and peripheral circuits.
• High-density consumer and industrial PCBs — Low-profile, tape-fed SMD format supports automated assembly and space-constrained board designs.

Unique Advantages

• AEC-Q200 qualification: Supplies a level of automotive-grade reliability for designs requiring industry-recognized stress testing and screening.
• Wide operating temperature: –40°C to +105°C rating maintains capacitance and performance across harsh thermal environments.
• Compact, assembly-friendly package: Chip-type can packaged for tape-fed automated placement simplifies BOM and speeds production on high-density boards.
• Documented endurance: 1000 hours at 105°C with defined limits on capacitance change and leakage current supports predictable long-term behavior.
• Clear ripple/frequency guidance: Published ripple current values and frequency coefficients allow accurate selection for power filtering across common switching frequencies.
• RoHS compliant: Conforms to current RoHS directives for environmentally regulated designs.

Why Choose UZG1H100MCL1GB?

The UZG1H100MCL1GB positions itself as a compact, automotive-capable aluminum electrolytic solution for engineers needing reliable decoupling and smoothing in space-constrained boards. Its combination of 50 V rating, documented ripple behavior, and AEC-Q200 qualification makes it suitable for demanding embedded power applications that require predictable performance over temperature and time.

Designers benefit from the low-profile SMD can and tape-fed compatibility for automated assembly, plus clear endurance and leakage specifications that support equipment qualification and lifecycle planning.

Request a quote or contact sales to discuss availability, volume pricing, and lead times for the UZG1H100MCL1GB.