UZG1E4R7MCL1GB

The UZG1E4R7MCL1GB is a Nichicon UZG series aluminum electrolytic chip capacitor in a surface-mount can package. It delivers 4.7 µF capacitance at 25 V in a compact φ4 × 3.9 mm footprint designed for high-density PCB assemblies and automated placement.

Engineered for reliability across a wide temperature range, this part offers AEC-Q200 qualification, low leakage and defined ripple-current ratings—making it suitable for demanding automotive and industrial surface-mount applications that require stable bulk capacitance and long-term endurance.

Key Features

• Capacitance & Voltage — 4.7 µF rated capacitance with ±20% tolerance at 25 V, providing predictable capacitance for board-level energy storage and decoupling.
• Compact Chip Package — Chip-type surface-mount can (φ4 × 3.9 mm) optimized for high-density PCBs; surface-mount land size L: 4.3 × W: 4.3 mm simplifies footprint planning.
• Wide Temperature Range — Rated to operate from −40 °C to +105 °C, supporting designs that must perform across harsh ambient conditions.
• Endurance — 1000 hours life at 105 °C with defined post-test limits for capacitance change, tan δ and leakage current to ensure long-term stability under elevated temperature stress.
• Low Leakage & Ripple Performance — Specified leakage current of 3 µA and ripple-current ratings of 11 mA at 120 Hz and 16.5 mA at 10 kHz for predictable behavior in low-standby and filtered power rails.
• Assembly-Friendly Packaging — Supplied on embossed carrier tape for automated mounting machines, facilitating high-volume surface-mount production.
• Quality & Compliance — AEC-Q200 qualified and RoHS compliant, aligning with automotive-grade reliability and environmental requirements.

Typical Applications

• Automotive electronic modules — Suitable for in-vehicle electronic control modules and other automotive assemblies where AEC-Q200 qualification and wide temperature operation are required.
• Compact power filtering and decoupling — Provides bulk capacitance and ripple handling in space-constrained surface-mount power rails on high-density PCBs.
• Automated assembly environments — Embossed carrier taping and chip-type SMD construction enable efficient placement for high-volume production.

Unique Advantages

• Automotive-ready qualification: AEC-Q200 rating supports use in vehicle electronics and other applications demanding automotive-grade reliability.
• Long-term thermal endurance: 1000 hours at 105 °C endurance specification provides predictable aging behavior for designs exposed to elevated temperatures.
• Low standby drain: Specified 3 µA leakage current helps minimize leakage-related power loss in low-power states.
• Defined ripple capability: Rated ripple currents at 120 Hz and 10 kHz give clear limits for power-supply filtering and smoothing designs.
• Space-efficient SMD can: φ4 × 3.9 mm chip can package conserves board real estate while enabling high-density layouts.
• Production-friendly supply: Embossed carrier taping supports automated pick-and-place for consistent assembly throughput.

Why Choose UZG1E4R7MCL1GB?

The UZG1E4R7MCL1GB combines Nichicon’s UZG series chip-can construction with automotive-grade qualification and clearly specified electrical and environmental limits. Its balance of compact footprint, low leakage, defined ripple current ratings and 1000‑hour endurance at 105 °C makes it a practical choice for engineers designing robust, space-conscious power and decoupling solutions for automotive and industrial electronics.

With mass-production availability from Nichicon and assembly-focused packaging, this part is suited to teams that require predictable performance, streamlined manufacturing, and components rated for harsh operating conditions.

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