UZG1H010MCL1GB

The UZG1H010MCL1GB from Nichicon is a chip-style aluminum electrolytic capacitor in the UZG series designed for surface mounting on high-density PC boards. It offers a 1 µF capacitance at a 50 V rating in a compact SMD radial can package, optimized for automated assembly lines and constrained board layouts.

This component is specified for a wide operating temperature range (−40 °C to +105 °C) and is AEC-Q200 qualified and RoHS compliant, providing a selection suitable for reliability-focused designs requiring standardized qualification and environmental compliance.

Key Features

• Package & Mounting Chip-type radial can SMD designed for surface mounting on high-density PC boards; applicable to automatic mounting machines fed with carrier tape.
• Electrical Characteristics 1 µF capacitance, 50 V rated voltage, polarized, with tolerance ±20% (at 120 Hz, 20 °C).
• Temperature & Endurance Operating range −40 °C to +105 °C with endurance rated to 1000 hours at 105 °C.
• Ripple Current Specified ripple current performance includes 5.4 mA at 120 Hz and 8.1 mA at 10 kHz.
• Reliability & Compliance AEC-Q200 qualified and compliant with the RoHS directive (2011/65/EU, (EU)2015/863).
• Mechanical Dimensions Compact footprint: L 3.9 × D 4 mm; recommended PCB land size L 4.3 × W 4.3 mm; low-profile SMD form factor for tight layouts.
• Leakage & Dielectric Loss Leakage current specification: after 2 minutes at rated voltage and 20 °C, not more than 0.01 CV or 3 µA (whichever is greater); tan δ limits are defined per rated voltage in the UZG series datasheet.

Typical Applications

• Automotive Electronics Suitable for automotive modules that require AEC-Q200 qualified components and operate across wide temperature ranges.
• High-density Surface-Mount Boards Low-profile chip package for power and board-level applications on densely populated PCBs.
• Automated Assembly Lines Designed for compatibility with carrier-tape fed automatic mounting equipment to streamline high-volume production.

Unique Advantages

• AEC-Q200 Qualification: Qualification provides a clear reliability benchmark for use in quality-focused and automotive-related designs.
• Wide Temperature Range: −40 °C to +105 °C operation supports applications exposed to extended environmental extremes.
• Compact, Low-Profile SMD Form: Small L 3.9 × D 4 mm footprint and recommended land pattern reduce board space while enabling surface-mount assembly.
• Assembly-Friendly: Designed for automatic mounting with carrier tape to reduce handling and improve production throughput.
• Defined Endurance: 1000 hours at 105 °C endurance rating provides a measurable longevity metric for thermal stress planning.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for modern electronic products.

Why Choose UZG1H010MCL1GB?

UZG1H010MCL1GB combines a compact chip-style SMD package with defined electrical and environmental specifications that make it suitable for space-constrained, reliability-focused assemblies. Its 1 µF / 50 V rating, polarized design, and specified ripple current values support stable filtering and energy storage in board-level power domains.

Backed by AEC-Q200 qualification and RoHS compliance, this Nichicon UZG series part is aimed at engineers and buyers who need a verifiable component for production environments that demand automated assembly compatibility and predictable thermal endurance.

Request a quote or submit a parts inquiry for UZG1H010MCL1GB to check availability, lead times, and procurement options for your next design.