UZG1C470MCL1GB

The UZG1C470MCL1GB is a chip-type aluminum electrolytic capacitor in the Nichicon UZG series, specified at 47 µF and 16 V. It is designed for surface mounting on high-density printed circuit boards and is compatible with automatic mounting machines fed by carrier tape.

Engineered for demanding environments, this component operates across a wide temperature range of –40 °C to +105 °C, meets AEC-Q200 qualification, and is RoHS compliant, making it suitable for applications requiring robust temperature endurance and recognized reliability criteria.

Key Features

• Capacitance & Voltage — Rated at 47 µF with a 16 V nominal voltage and a capacitance tolerance of ±20% (120 Hz, 20 °C).
• Wide Temperature Range — Specified for operation from –40 °C to +105 °C to support applications with broad environmental requirements.
• Endurance — Qualified for 1000 hours at 105 °C with specified limits: capacitance change within ±30%, tan δ within 300% of initial, and leakage current not exceeding initial value after the test.
• Low-Temperature Stability — For the 16 V rating, impedance ratios are specified (Z(–25 °C)/Z(+20 °C) ≤ 3; Z(–40 °C)/Z(+20 °C) ≤ 6), providing clear guidance on low-temperature performance.
• Ripple Current Characteristics — Rated ripple current values include 44 mA at 120 Hz and 66 mA at 10 kHz; frequency coefficients are provided (e.g., 0.70 at 50 Hz, 1.00 at 120 Hz, 1.50 at ≥10 kHz) for frequency-dependent sizing.
• Surface-Mount, Tape-Feed Compatible — Chip-type SMD package (φD×L: 6.3 × 3.9 mm) with a recommended land size of 6.6 × 6.6 mm; designed for automatic placement from carrier tape.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant to relevant directives.
• Leakage Current Specification — After 2 minutes at rated voltage and 20 °C, leakage current is specified as ≤ 0.01 CV or 3 µA (whichever is greater), providing a clear electrical leakage benchmark.

Typical Applications

• Automotive Electronics — Power filtering and decoupling in control modules and sensor interfaces where AEC-Q200 qualification and wide temperature operation are required.
• High-Density PCB Designs — Bulk decoupling and smoothing on compact boards where a low-profile, tape-fed SMD capacitor enables automated assembly.
• Industrial Control — Power rail stabilization and noise suppression in equipment exposed to wide temperature ranges and continuous operation.

Unique Advantages

• Compact SMD Form Factor: Small chip-type package (6.3 × 3.9 mm) and recommended land pattern (6.6 × 6.6 mm) save board space and enable high-density placement.
• Designed for Automated Assembly: Compatibility with carrier tape feeding simplifies pick-and-place processing and improves manufacturing throughput.
• Qualified Reliability: AEC-Q200 qualification and defined endurance at 105 °C support use in applications with strict reliability requirements.
• Wide Temperature Operation: –40 °C to +105 °C rating helps maintain capacitor function across harsh environmental conditions.
• Frequency-Aware Ripple Performance: Published ripple current values and frequency coefficients allow engineers to size capacitors accurately across operating frequencies.
• Clear Leakage and Loss Metrics: Specified leakage current formula and tan δ limits provide verifiable electrical performance parameters for design validation.

Why Choose UZG1C470MCL1GB?

UZG1C470MCL1GB is positioned for engineers who need a small, surface-mount aluminum electrolytic capacitor with documented endurance, temperature performance, and frequency-dependent ripple data. Its tape-feed compatibility and compact footprint make it well suited to automated, high-density PCB assembly flows.

With AEC-Q200 qualification, RoHS compliance, and clearly defined electrical and environmental specifications, this part provides predictable behavior for long-term designs in automotive, industrial, and other temperature-challenging applications.

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