UZG0J330MCL1GB

The UZG0J330MCL1GB is a chip-type aluminum electrolytic capacitor in a low-profile surface-mount can designed for high-density PC board assemblies. It delivers 33 µF capacitance at a rated voltage of 6.3 V with polarized construction and compact dimensions suited for automated mounting.

Engineered for demanding temperature and reliability requirements, this capacitor supports operation from −40°C to +105°C, carries AEC-Q200 qualification, and is RoHS compliant—making it appropriate for automotive and other robust electronics applications.

Key Features

• Package & Mounting Chip-type radial can in an SMD package designed for surface mounting on high-density PCBs; compatible with automatic mounting machines fed with carrier tape.
• Electrical Characteristics 33 µF capacitance at 6.3 V rated voltage with ±20% tolerance and polarized construction.
• Temperature Range Rated for operation from −40°C to +105°C to support wide ambient and thermal environments.
• Reliability & Endurance Endurance rating of 1000 hours at 105°C with specified limits for capacitance change, tan δ and leakage current.
• Ripple Current Specified ripple current: 26 mA at 120 Hz and 39 mA at 10 kHz for the part.
• Leakage and Loss Leakage current meets the series specification (not more than 0.01 CV or 3 µA after 2 minutes at 20°C); tan δ (max.) at 6.3 V is 0.38 at 120 Hz, 20°C.
• Dimensions & Land Pattern Component size: 3.9 mm × 5 mm (L × D). Recommended surface-mount land size: 5.3 mm × 5.3 mm.
• Standards & Compliance AEC-Q200 qualified for designs requiring that qualification; RoHS compliant to the listed directives.

Typical Applications

• Automotive Electronics — Suited for automotive modules and control units where AEC-Q200 qualification and wide temperature operation are required.
• High-density SMD Assemblies — Low-profile chip-type package makes it appropriate for compact, space-constrained PCB layouts.
• Automated Production — Designed for use with carrier-tape fed automatic mounting machines to support high-volume manufacturing.

Unique Advantages

• Compact, low-profile form factor: 3.9 mm × 5 mm footprint provides electrolytic capacitance in a small SMD can suitable for dense PCBs.
• Automated-assembly ready: Compatible with carrier-tape automatic mounting to streamline pick-and-place production.
• Wide operating temperature: −40°C to +105°C rating supports challenging thermal environments.
• Proven endurance: 1000 hours at 105°C endurance rating provides a defined life expectancy for thermal stress conditions.
• Defined ripple performance: Manufacturer-specified ripple current values at 120 Hz and 10 kHz allow designers to size components against application ripple requirements.
• Quality and regulatory compliance: AEC-Q200 qualification and RoHS compliance support regulated and reliability-focused designs.

Why Choose UZG0J330MCL1GB?

UZG0J330MCL1GB combines compact SMD packaging with verified endurance and thermal performance for applications that require stable electrolytic capacitance in constrained board space. Its AEC-Q200 qualification and RoHS compliance make it a practical choice for designs where qualification and regulatory adherence matter.

This part is well suited to engineers designing compact, production-oriented assemblies that demand predictable ripple, leakage, and long-term performance at elevated temperature. Its compatibility with automated mounting processes supports efficient manufacturing and repeatable assembly results.

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