10AX016C3U19I2SG

The 10AX016C3U19I2SG is an Intel Arria 10 GX family FPGA in a 484-BFBGA package. It delivers mid-range, 20‑nm class FPGA capability with a balance of logic density, embedded memory, and I/O suitable for industrial applications.

Key on-board resources include 160,000 logic elements, 10,086,400 total RAM bits, and 240 general-purpose I/O pins. The device operates from a core supply range of 870 mV to 980 mV and supports an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 160,000 logic elements provide the programmable fabric to implement complex custom logic and control functions.
• Embedded Memory 10,086,400 total RAM bits of on-chip memory enable large buffering, packet processing, and data-path storage without immediate reliance on external memory.
• I/O and Connectivity 240 general-purpose I/O pins allow flexible interface options to peripherals, memory, and system-level interconnects.
• Power and Voltage Core voltage supply range of 870 mV to 980 mV for device operation; power-management features and process-level efficiency are documented for the Arria 10 family.
• Package and Mounting 484‑BFBGA package (supplier device package: 484‑UBGA, 19×19) designed for surface-mount assembly to support compact board layouts.
• Industrial Temperature Grade Rated for −40 °C to 100 °C operation, suitable for industrial environments requiring wide-temperature operation.
• Arria 10 Family Capabilities As an Arria 10 GX device, the family-level feature set includes embedded memory blocks, variable-precision DSP resources, low-power serial transceivers, and hard IP blocks (such as PCIe and Ethernet) documented for the device family.
• RoHS Compliant Device conforms to RoHS environmental requirements.

Typical Applications

• Wireless Infrastructure Channel and switch card processing, remote radio head functions and mobile backhaul where programmable logic and on-chip memory accelerate signal processing and control.
• Networking and Wireline Line cards, muxponders and transponders in 40G/100G systems that benefit from high logic density and embedded memory for packet buffering and protocol implementation.
• Broadcast and Professional AV Video switching, encoding/decoding support and transport where deterministic I/O and on-chip memory simplify signal paths.
• Compute and Storage Acceleration Cloud and server acceleration functions, flash cache control and data-path offload that use programmable logic and DSP resources.
• Industrial and Medical Systems Imaging, diagnostic scanners and industrial control applications that require wide-temperature operation and a compact BGA footprint.

Unique Advantages

• Substantial Logic Capacity: 160,000 logic elements enable implementation of complex custom algorithms and multi-function designs on a single device.
• Large On‑Chip Memory: Over 10 million RAM bits reduce dependence on external memory for buffering and accelerate data-path operations.
• Flexible I/O Count: 240 I/Os support diverse interface requirements, simplifying board-level routing for mixed-signal and digital subsystems.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or wide-range environments.
• Compact, Surface-Mount Package: 484‑BFBGA (484‑UBGA 19×19) offers a dense package option for space-constrained PCBs while maintaining required signal density.
• Family-Level Integration: Membership in the Arria 10 GX family provides documented features such as DSP blocks, embedded memory architectures, serial transceivers and protocol hard IP to accelerate design development.

Why Choose 10AX016C3U19I2SG?

This Arria 10 GX device balances programmable logic density, substantial on-chip RAM, and broad I/O capability in a compact industrial-temperature BGA package. It suits designers who need mid-range FPGA resources with family-level features for communications, compute acceleration, and high-performance embedded systems.

Choosing this device provides a clear upgrade path within the Arria 10 family and leverages the documented device-level capabilities for power efficiency, transceiver and protocol IP, and memory configurations for scalable, robust designs.

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