10AX016C3U19E2SG

The 10AX016C3U19E2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) supplied in a 484‑BFBGA package. It is a 20‑nm mid‑range FPGA family member intended for high‑performance, power‑sensitive midrange applications across communications, broadcast, computing, medical, and defense markets.

This device combines a large logic fabric with substantial embedded RAM and a broad I/O count, offering designers a programmable platform for data‑plane processing, protocol bridging, accelerated computing functions, and advanced communications interfaces.

Key Features

• Logic Capacity — 160,000 logic elements to implement complex custom logic, control functions, and datapath processing.
• Embedded Memory — 10,086,400 total RAM bits for on‑chip buffering, lookup tables, and packet or frame storage.
• Programmable I/O — 240 I/O pins to support diverse interface requirements and board‑level connectivity.
• Package & Mounting — 484‑BFBGA (supplier package: 484‑UBGA, 19×19) in a surface‑mount configuration for compact PCB integration.
• Power Supply — Core voltage range 870 mV to 980 mV to match system power domains and supply rails.
• Operating Range — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in temperature‑controlled equipment and infrastructure.
• RoHS Compliance — Device is RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul where programmable logic enables protocol adaptation and signal processing.
• Wireline Networking — Line cards, muxponders, and transponders for 40G/100G systems that require on‑chip logic and memory for packet handling and aggregation.
• Broadcast and Media — Studio switching and videoconferencing systems that benefit from customizable I/O and substantial on‑chip memory for frame buffering and format conversion.
• Compute & Storage Acceleration — Cloud and server acceleration functions, including flash cache controllers and inline data processing, leveraging dense logic and embedded RAM.
• Medical and Defense Systems — Diagnostic imaging, radar, and secure communications subsystems where programmable hardware enables application‑specific signal and control processing.

Unique Advantages

• Large Logic Fabric: 160,000 logic elements provide headroom for complex finite‑state machines, datapaths, and custom accelerators without external ASIC development.
• High On‑Chip Memory: Over 10 million RAM bits reduce reliance on external memory for buffering and lookup, simplifying board design and lowering latency.
• Flexible I/O Count: 240 I/O pins enable multiple parallel interfaces or a mix of high‑speed and general‑purpose connectivity on a single device.
• Compact Surface‑Mount Package: 484‑BFBGA (19×19 UBGA footprint) supports dense PCB layouts and thermal mounting practices common in networking and compute modules.
• Extended Operating Range: Rated 0 °C to 100 °C for reliable operation in temperature‑controlled equipment and infrastructure environments.
• Regulatory Alignment: RoHS compliance supports environmental requirements for modern electronic manufacturing.

Why Choose 10AX016C3U19E2SG?

The 10AX016C3U19E2SG delivers a balance of significant logic resources, extensive embedded RAM, and flexible I/O in a compact BGA package—making it well suited for midrange systems that require programmable acceleration, protocol handling, and on‑device buffering. Its 20‑nm Arria 10 architecture targets power‑sensitive designs where integration and performance must coexist.

This device is a fit for engineering teams designing communications equipment, media processing systems, server accelerators, and instrumentation that require a scalable, supported FPGA platform with verifiable specifications for power, thermal, and I/O integration.

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