10AX016C4U19I3LG

IC FPGA 240 I/O 484UBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 484-BFBGA

Quantity 355 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016C4U19I3LG – Arria 10 GX FPGA (484-BFBGA)

The 10AX016C4U19I3LG is an Intel Arria 10 GX Field Programmable Gate Array in a 484‑BFBGA (484‑UBGA, 19×19) package. It is a 20 nm mid-range FPGA family device designed for high-performance, power-sensitive applications across communications, broadcast, computing, medical, and defense markets.

With a combination of large logic capacity, substantial embedded RAM, and support for high-speed interfaces and hard IPs, this device targets midrange designs that require integration, thermal robustness, and a compact surface-mount package.

Key Features

  • Logic Capacity  160,000 logic elements for implementing complex digital logic and control functions.
  • Embedded Memory  Total on-chip RAM of 10,086,400 bits to support buffering, caches, and local data storage.
  • I/O Resources  240 I/O pins to support diverse peripheral interfaces and board-level connectivity.
  • High-speed Interfaces & Hard IP  Family-level support for PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet, and Interlaken as noted in the device overview.
  • DSP & Compute Blocks  Variable-precision DSP blocks and adaptive logic modules for signal processing and arithmetic acceleration (described in the Arria 10 device overview).
  • Package & Mounting  484‑BFBGA (484‑UBGA, 19×19) package; surface-mount mounting type for compact board designs.
  • Power & Voltage  Core voltage supply range 870 mV to 930 mV for the device core.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployments in demanding environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging the device’s logic and DSP resources.
  • Wireline Networking  40G/100G muxponders, transponders and 100G line cards for line-rate packet processing and aggregation.
  • Broadcast & Professional A/V  Studio switches, transport servers, and videoconferencing systems that require real-time processing and flexible I/O routing.
  • Computing & Storage  Flash cache controllers, cloud server acceleration, and server offload applications making use of embedded RAM and hard IP interfaces.
  • Medical & Military Systems  Diagnostic imaging, radar, and electronic warfare applications that demand industrial temperature operation and robust logic/memory resources.

Unique Advantages

  • Substantial Logic Resources: 160,000 logic elements provide headroom for complex state machines, packet processing, and control logic.
  • Large On‑Chip RAM: 10,086,400 bits of embedded memory reduce external memory dependence for buffering and temporary data storage.
  • Broad Interface Support: 240 I/Os plus family-level hard IP options for PCIe and 10 Gbps Ethernet enable integration of high-speed links.
  • Industrial Thermal Range: Rated for −40 °C to 100 °C operation, suitable for demanding environmental deployments.
  • Low‑Voltage Core: Narrow core voltage window (870–930 mV) supports optimized power delivery and platform power planning.
  • Regulatory Compliance: RoHS compliance for global electronics manufacturing requirements.

Why Choose 10AX016C4U19I3LG?

The 10AX016C4U19I3LG Arria 10 GX FPGA combines a significant logic footprint, multi-megabit embedded RAM, and extensive I/O capability in a compact 484‑BFBGA surface‑mount package. It is positioned for mid-range designs that need a balance of performance, power efficiency, and integration for communications, compute acceleration, and professional imaging or sensing systems.

Its industrial temperature rating, low-voltage core range, and RoHS compliance make it suitable for long-life production deployments where thermal robustness and regulatory alignment matter. The device is appropriate for engineering teams designing scalable, high-throughput systems that require on-chip DSP resources and hard IP support for standard high-speed interfaces.

Request a quote or submit an inquiry to get pricing and availability for 10AX016C4U19I3LG. Our team can provide lead-time information and configuration assistance to support your design and procurement process.

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