10AX016E3F27E1SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA

Quantity 294 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F27E1SG – Arria 10 GX Field Programmable Gate Array (FPGA), 160000 logic elements, 10,086,400 RAM bits, 240 I/O, 672-BBGA

The 10AX016E3F27E1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 672-ball FCBGA package designed for mid-range, high-performance, power-efficient designs. It combines a large logic fabric with substantial embedded RAM and a high I/O count to address demanding applications across wireless, wireline, broadcast, computing and storage, medical, and military markets.

As part of the Arria 10 device family, this device is optimized for performance and power efficiency and includes architecture-level features such as DSP blocks, embedded memory, advanced clocking and serial/transceiver support to help implement complex interfaces and processing pipelines.

Key Features

  • Logic Capacity — 160,000 logic elements to implement large, complex digital designs and custom processing pipelines.
  • Embedded Memory — 10,086,400 total RAM bits for on-chip buffering, large-state machines, and data-path storage.
  • I/O and Package — 240 user I/O pins in a 672-FBGA (27×27) surface-mount package for dense board-level connectivity and routing.
  • Power Supply — Core voltage range 870 mV to 930 mV to match Arria 10 device power domains and enable optimized power management.
  • Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many commercial and industrial-environment applications.
  • Transceivers and Interfaces — Supports the Arria 10 family’s low-power serial transceivers and enhanced PCS/PHY hard IP for high-speed interfaces (series-level capabilities).
  • Clocking and System Integration — Advanced clock networks with PLL and fractional synthesis support as provided across the Arria 10 family for flexible timing architectures.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul, leveraging high logic density and on-chip memory for signal processing and protocol handling.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards where integrated transceivers and logic density accelerate packet processing and interfacing.
  • Broadcast and Professional AV — Studio switches, transport and video processing systems that require flexible I/O and substantial on-chip buffering.
  • Computing and Storage Acceleration — Server acceleration, flash cache and cloud infrastructure functions that use FPGA-based offload and custom logic implementations.
  • Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare subsystems that benefit from the Arria 10 family’s balance of performance and power efficiency.

Unique Advantages

  • High Logic and Memory Integration: 160,000 logic elements combined with over 10 million RAM bits reduce the need for external memory and simplify complex designs.
  • Dense I/O in a Compact Package: 240 I/O pins in a 672-FBGA (27×27) package enable high I/O connectivity while maintaining a compact board footprint.
  • Arria 10 Family Capabilities: Family-level support for DSP blocks, advanced clocking, PCIe hard IP and serial transceivers allows reuse of established architecture features across designs.
  • Power-Focused Design: Operates within a defined core voltage range (870–930 mV) and is part of a device family designed for power efficiency, helping optimize system power budgets.
  • Extended Grade and RoHS Compliance: Extended temperature grade (0 °C to 100 °C) and RoHS compliance support deployment in a wide range of environments with regulatory alignment.

Why Choose 10AX016E3F27E1SG?

The 10AX016E3F27E1SG positions itself as a capable Arria 10 GX FPGA option for mid-range systems that require a balance of logic density, embedded memory, and I/O capability within a compact FCBGA package. It suits engineers implementing high-throughput data paths, protocol engines, and hardware-accelerated functions who need the Arria 10 family’s system-level features.

Backed by the Arria 10 device documentation and device-level resources, this part supports designs that benefit from scalable architecture, integrated system IP, and vendor-provided design materials for development and verification.

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