10AX016E3F27E1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA |
|---|---|
| Quantity | 205 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 61510 | Number of Logic Elements/Cells | 160000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10086400 |
Overview of 10AX016E3F27E1HG – Arria 10 GX FPGA, 672-BBGA FCBGA
The 10AX016E3F27E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 672-BBGA (27×27) FCBGA package. Built on the Arria 10 device family architecture, this part targets mid-range applications that require a balance of performance and power efficiency.
Key capabilities for this device include a high logic capacity, substantial on-chip RAM, and a broad I/O count—making it suitable for applications across wireless, wireline, broadcast, computing and storage, medical, and military markets as described for the Arria 10 family.
Key Features
- Core Logic — 160,000 logic elements provide programmable logic capacity for complex custom logic, packet processing, and hardware acceleration tasks.
- Logic Array Density — Device listing includes 61,510 logic array blocks (reported in device data) to support large-scale logic partitioning and hierarchical design.
- Embedded Memory — 10,086,400 total RAM bits of on-chip memory for buffering, lookup tables, and embedded data structures.
- General-Purpose I/O — 240 I/O pins available for a wide range of external interfaces and signaling requirements.
- Power and Voltage — Supported supply voltage range of 870 mV to 930 mV, reflecting the device’s low-voltage core operation and power-sensitive design considerations.
- Package & Mounting — 672-BBGA (672-FBGA, 27×27) surface-mount package for high-density board integration.
- Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
- Device Family Capabilities — As part of the Arria 10 family, the device series provides features such as low-power serial transceivers, external memory interface support, PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet support, dynamic and partial reconfiguration, and SEU error detection and correction (series-level features described in the Arria 10 overview).
Typical Applications
- Wireless Infrastructure — Channel and switch card implementations in radio head and backhaul equipment where programmable logic and embedded memory accelerate baseband and packet processing.
- Wireline Networking — Line cards, muxponders, and transponders that benefit from high logic density and on-chip RAM for packet handling and protocol offload.
- Broadcast & Professional AV — Studio switches and video transport applications that require flexible I/O mapping and on-device buffering.
- Computing & Storage Acceleration — FPGA-based server acceleration, flash cache control, and cloud compute offload leveraging the device’s logic and memory resources.
- Medical & Defense Systems — Image processing and specialized signal processing implementations that use the device family’s performance and configurability.
Unique Advantages
- High programmable capacity: 160,000 logic elements enable complex logic implementations and hardware acceleration without additional ASIC development.
- Large on-chip RAM: Over 10 million RAM bits reduce dependence on external memory for buffers and lookup tables, simplifying board-level memory designs.
- Rich I/O resources: 240 I/O pins provide flexibility for multiple high-speed interfaces and mixed-signal board topologies.
- Compact, high-density packaging: 672-BBGA (27×27) FCBGA allows dense integration on modern PCBs while supporting high pin counts.
- Power-conscious operation: Low core supply range (870–930 mV) and Arria 10 family power-saving technologies support energy-efficient designs.
- Extended-grade reliability: Rated for 0 °C to 100 °C operation and designated as Extended grade for deployments requiring broader commercial temperature coverage.
Why Choose 10AX016E3F27E1HG?
The 10AX016E3F27E1HG Arria 10 GX FPGA combines substantial logic resources, multi-megabit on-chip memory, and a broad I/O complement in a compact 672-BBGA package. It is positioned for mid-range applications that need configurable hardware acceleration, flexible interface support, and power-aware operation within the Arria 10 device family.
This part suits engineering teams building networking, wireless, broadcast, compute-acceleration, or specialized signal-processing systems that rely on programmable logic density, embedded RAM, and family-level features such as serial transceivers, PCIe hard IP, and dynamic reconfiguration.
Request a quote or submit an inquiry for pricing and availability to evaluate the 10AX016E3F27E1HG for your next design.

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