10AX016E3F27E1HG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA

Quantity 205 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F27E1HG – Arria 10 GX FPGA, 672-BBGA FCBGA

The 10AX016E3F27E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 672-BBGA (27×27) FCBGA package. Built on the Arria 10 device family architecture, this part targets mid-range applications that require a balance of performance and power efficiency.

Key capabilities for this device include a high logic capacity, substantial on-chip RAM, and a broad I/O count—making it suitable for applications across wireless, wireline, broadcast, computing and storage, medical, and military markets as described for the Arria 10 family.

Key Features

  • Core Logic — 160,000 logic elements provide programmable logic capacity for complex custom logic, packet processing, and hardware acceleration tasks.
  • Logic Array Density — Device listing includes 61,510 logic array blocks (reported in device data) to support large-scale logic partitioning and hierarchical design.
  • Embedded Memory — 10,086,400 total RAM bits of on-chip memory for buffering, lookup tables, and embedded data structures.
  • General-Purpose I/O — 240 I/O pins available for a wide range of external interfaces and signaling requirements.
  • Power and Voltage — Supported supply voltage range of 870 mV to 930 mV, reflecting the device’s low-voltage core operation and power-sensitive design considerations.
  • Package & Mounting — 672-BBGA (672-FBGA, 27×27) surface-mount package for high-density board integration.
  • Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Device Family Capabilities — As part of the Arria 10 family, the device series provides features such as low-power serial transceivers, external memory interface support, PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet support, dynamic and partial reconfiguration, and SEU error detection and correction (series-level features described in the Arria 10 overview).

Typical Applications

  • Wireless Infrastructure — Channel and switch card implementations in radio head and backhaul equipment where programmable logic and embedded memory accelerate baseband and packet processing.
  • Wireline Networking — Line cards, muxponders, and transponders that benefit from high logic density and on-chip RAM for packet handling and protocol offload.
  • Broadcast & Professional AV — Studio switches and video transport applications that require flexible I/O mapping and on-device buffering.
  • Computing & Storage Acceleration — FPGA-based server acceleration, flash cache control, and cloud compute offload leveraging the device’s logic and memory resources.
  • Medical & Defense Systems — Image processing and specialized signal processing implementations that use the device family’s performance and configurability.

Unique Advantages

  • High programmable capacity: 160,000 logic elements enable complex logic implementations and hardware acceleration without additional ASIC development.
  • Large on-chip RAM: Over 10 million RAM bits reduce dependence on external memory for buffers and lookup tables, simplifying board-level memory designs.
  • Rich I/O resources: 240 I/O pins provide flexibility for multiple high-speed interfaces and mixed-signal board topologies.
  • Compact, high-density packaging: 672-BBGA (27×27) FCBGA allows dense integration on modern PCBs while supporting high pin counts.
  • Power-conscious operation: Low core supply range (870–930 mV) and Arria 10 family power-saving technologies support energy-efficient designs.
  • Extended-grade reliability: Rated for 0 °C to 100 °C operation and designated as Extended grade for deployments requiring broader commercial temperature coverage.

Why Choose 10AX016E3F27E1HG?

The 10AX016E3F27E1HG Arria 10 GX FPGA combines substantial logic resources, multi-megabit on-chip memory, and a broad I/O complement in a compact 672-BBGA package. It is positioned for mid-range applications that need configurable hardware acceleration, flexible interface support, and power-aware operation within the Arria 10 device family.

This part suits engineering teams building networking, wireless, broadcast, compute-acceleration, or specialized signal-processing systems that rely on programmable logic density, embedded RAM, and family-level features such as serial transceivers, PCIe hard IP, and dynamic reconfiguration.

Request a quote or submit an inquiry for pricing and availability to evaluate the 10AX016E3F27E1HG for your next design.

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