10AX016E3F27I1HG

The 10AX016E3F27I1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 672-FBGA (27×27) package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs and is built for applications that require substantial logic, embedded memory, and flexible I/O in a surface-mount package.

Typical use cases include mid-range communications, compute acceleration, and broadcast or imaging systems where on-chip resources, industrial temperature operation, and power-optimized supply ranges are important design considerations.

Key Features

• Logic Capacity  Provides 160,000 logic elements to implement complex custom logic and state machines.
• Embedded Memory  Includes 10,086,400 total RAM bits of on-chip memory for buffering, packet processing, and data-path storage.
• I/O Resources  Offers 240 user I/O pins suitable for interfaces and peripheral connectivity.
• Arria 10 Family Architecture  Built on the Arria 10 device family architecture, which includes features such as adaptive logic modules, variable-precision DSP blocks, and embedded memory blocks as described in the device overview.
• Clocking and PLLs  Arria 10 devices incorporate clock networks and PLL clock sources, including fractional synthesis and I/O PLLs, to support diverse clocking topologies.
• High-speed IP and Transceivers  The family overview lists PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for protocols such as Interlaken and 10 Gbps Ethernet, along with low-power serial transceivers and configurable PMA/PCS features.
• Package & Mounting  672-FBGA (27×27) package, designed for surface-mount assembly.
• Operating Conditions  Industrial-grade operation with an operating temperature range of −40 °C to 100 °C and a supply voltage range of 870 mV to 980 mV.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel processing and backhaul applications that benefit from on-chip DSP resources and high logic density.
• Wireline & Networking  Line cards, muxponders, and transponders using embedded memory and high-speed serial interfaces for packet aggregation and transport.
• Broadcast & Pro AV  Studio switching, video transport, and professional audio/video processing leveraging large on-chip memory and logic capacity.
• Compute & Storage Acceleration  Flash cache, cloud compute acceleration, and server offload tasks that use programmable logic and embedded memory.
• Medical & Imaging  Diagnostic imaging and scanner systems that need deterministic processing and the industrial temperature range.

Unique Advantages

• High Logic Density: 160,000 logic elements enable complex, high-performance custom logic implementations without external ASICs.
• Significant On-Chip Memory: Over 10 million bits of embedded RAM reduce external memory dependence and simplify data-path designs.
• Flexible I/O in a Compact Package: 240 I/Os in a 672-FBGA (27×27) package provide a balance of connectivity and board-level footprint.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
• Power-Optimized Supply Window: Supported supply range of 870 mV to 980 mV facilitates power-aware design and supply planning.
• Arria 10 Family Capabilities: Family-level features such as DSP blocks, PLLs, transceivers, and PCIe hard IP provide integration options that accelerate system design.

Why Choose 10AX016E3F27I1HG?

The 10AX016E3F27I1HG delivers a robust combination of logic capacity, embedded memory, and I/O in a surface-mount 672-FBGA package suitable for industrial operation. Its placement within the Intel Arria 10 family provides a range of architectural features—DSP blocks, clocking resources, transceivers, and PCIe hard IP—that support mid-range communications, compute acceleration, and high-performance embedded applications.

Designers seeking a scalable, programmable platform with verifiable on-chip resources and industrial temperature support will find this Arria 10 GX device a practical choice for systems requiring significant on-chip RAM and logic while maintaining compact board-level integration.

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