10AX016E3F27I1SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA

Quantity 352 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F27I1SG – Arria 10 GX FPGA, 160000 logic elements, 10,086,400-bit RAM

The 10AX016E3F27I1SG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 672-BBGA (672-FBGA, 27×27) surface-mount package. It delivers a mid-range, 20‑nm FPGA architecture that targets power‑efficient, high‑performance applications across wireless, wireline, broadcast, computing and other markets.

With 160,000 logic elements, 10,086,400 total RAM bits and 240 user I/Os, this industrial‑grade device is designed for designers who need substantial programmable logic capacity, large embedded memory, and wide I/O connectivity in a single package.

Key Features

  • Core Logic  160,000 logic elements provide substantial programmable capacity for complex mid‑range designs.
  • Embedded Memory  10,086,400 total RAM bits support large on‑chip buffering, frame storage, and algorithm acceleration.
  • I/O and Connectivity  240 user I/Os enable broad interfacing options for external memory, networking, or sensor subsystems.
  • Package & Mounting  Delivered in a 672‑BBGA (supplier package: 672‑FBGA, 27×27) surface‑mount package for compact, high‑density PCB designs.
  • Power Supply  Operates from an 870 mV to 980 mV core supply range to match system power rails and design constraints.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
  • Family-Level Capabilities (Arria 10)  The Arria 10 device family provides 20‑nm mid‑range FPGA architecture, power‑saving technologies, DSP building blocks, embedded memory structures, PLL clock networks, and serial transceiver support as described by the device family documentation.
  • Compliance  RoHS‑compliant manufacturing.

Typical Applications

  • Wireless Infrastructure  Channel processing, fronthaul/backhaul logic and interface aggregation where programmable DSP and large on‑chip memory improve latency and flexibility.
  • Wireline Networking  Line cards, muxponders and transponders that require mid‑range FPGA logic, embedded memory and broad I/O support.
  • Broadcast and Video  Video transport, switching and professional audio/video processing leveraging large memory and high logic capacity for format conversion and buffering.
  • Computing & Storage  Acceleration, cache buffering and data path control in cloud or storage systems that benefit from programmable logic and on‑chip RAM.

Unique Advantages

  • High logic capacity: 160,000 logic elements enable complex algorithms and parallel processing in a single FPGA.
  • Substantial on‑chip memory: 10,086,400 total RAM bits reduce dependence on external memory for many buffering and caching tasks.
  • Broad I/O count: 240 I/Os facilitate diverse interfaces and high‑pin‑count system integration without added bridge devices.
  • Industrial temperature range: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
  • Compact, high‑density package: 672‑FBGA (27×27) BGA package balances board area and pin count for space‑constrained designs.
  • Family ecosystem: Arria 10 family features such as DSP blocks, PLL clocking and serial transceiver support provide a platform of capabilities described in the device documentation.

Why Choose 10AX016E3F27I1SG?

The 10AX016E3F27I1SG positions itself as a mid‑range, industrial‑grade Arria 10 GX FPGA that combines high programmable logic density, large embedded RAM, and significant I/O capacity in a compact BGA package. Its 20‑nm family architecture and power‑conscious design make it suitable for performance‑sensitive applications that also demand efficiency and robust thermal operation.

This device is a fit for engineering teams building mid‑range telecom, networking, broadcast, and compute‑acceleration systems that require on‑device memory, flexible I/O, and the Arria 10 family capabilities documented for system integration and design scaling.

Request a quote or submit a part inquiry to confirm availability, pricing, and lead times for the 10AX016E3F27I1SG.

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