10AX016E3F27I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA |
|---|---|
| Quantity | 352 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 61510 | Number of Logic Elements/Cells | 160000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10086400 |
Overview of 10AX016E3F27I1SG – Arria 10 GX FPGA, 160000 logic elements, 10,086,400-bit RAM
The 10AX016E3F27I1SG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 672-BBGA (672-FBGA, 27×27) surface-mount package. It delivers a mid-range, 20‑nm FPGA architecture that targets power‑efficient, high‑performance applications across wireless, wireline, broadcast, computing and other markets.
With 160,000 logic elements, 10,086,400 total RAM bits and 240 user I/Os, this industrial‑grade device is designed for designers who need substantial programmable logic capacity, large embedded memory, and wide I/O connectivity in a single package.
Key Features
- Core Logic 160,000 logic elements provide substantial programmable capacity for complex mid‑range designs.
- Embedded Memory 10,086,400 total RAM bits support large on‑chip buffering, frame storage, and algorithm acceleration.
- I/O and Connectivity 240 user I/Os enable broad interfacing options for external memory, networking, or sensor subsystems.
- Package & Mounting Delivered in a 672‑BBGA (supplier package: 672‑FBGA, 27×27) surface‑mount package for compact, high‑density PCB designs.
- Power Supply Operates from an 870 mV to 980 mV core supply range to match system power rails and design constraints.
- Operating Temperature Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
- Family-Level Capabilities (Arria 10) The Arria 10 device family provides 20‑nm mid‑range FPGA architecture, power‑saving technologies, DSP building blocks, embedded memory structures, PLL clock networks, and serial transceiver support as described by the device family documentation.
- Compliance RoHS‑compliant manufacturing.
Typical Applications
- Wireless Infrastructure Channel processing, fronthaul/backhaul logic and interface aggregation where programmable DSP and large on‑chip memory improve latency and flexibility.
- Wireline Networking Line cards, muxponders and transponders that require mid‑range FPGA logic, embedded memory and broad I/O support.
- Broadcast and Video Video transport, switching and professional audio/video processing leveraging large memory and high logic capacity for format conversion and buffering.
- Computing & Storage Acceleration, cache buffering and data path control in cloud or storage systems that benefit from programmable logic and on‑chip RAM.
Unique Advantages
- High logic capacity: 160,000 logic elements enable complex algorithms and parallel processing in a single FPGA.
- Substantial on‑chip memory: 10,086,400 total RAM bits reduce dependence on external memory for many buffering and caching tasks.
- Broad I/O count: 240 I/Os facilitate diverse interfaces and high‑pin‑count system integration without added bridge devices.
- Industrial temperature range: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
- Compact, high‑density package: 672‑FBGA (27×27) BGA package balances board area and pin count for space‑constrained designs.
- Family ecosystem: Arria 10 family features such as DSP blocks, PLL clocking and serial transceiver support provide a platform of capabilities described in the device documentation.
Why Choose 10AX016E3F27I1SG?
The 10AX016E3F27I1SG positions itself as a mid‑range, industrial‑grade Arria 10 GX FPGA that combines high programmable logic density, large embedded RAM, and significant I/O capacity in a compact BGA package. Its 20‑nm family architecture and power‑conscious design make it suitable for performance‑sensitive applications that also demand efficiency and robust thermal operation.
This device is a fit for engineering teams building mid‑range telecom, networking, broadcast, and compute‑acceleration systems that require on‑device memory, flexible I/O, and the Arria 10 family capabilities documented for system integration and design scaling.
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