10AX016E3F27I2LG

The 10AX016E3F27I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 672-ball FCBGA package. It combines a high logic capacity and substantial embedded RAM with a broad I/O complement and an industrial operating range for demanding mid-range applications.

Designed for performance and power efficiency within the Arria 10 device family, this device targets markets such as wireless and wireline communications, broadcast, computing and storage, medical diagnostics and defense, where high logic density, on-chip memory and robust I/O are required.

Key Features

• Logic Capacity  160,000 logic elements (LEs) provide significant programmable logic density for complex digital designs.
• Embedded Memory  10,086,400 total RAM bits for on-chip buffering, packet processing and data staging.
• General-Purpose I/O  240 I/O pins to support diverse interfaces and parallel connectivity requirements.
• Package & Mounting  672-BBGA FCBGA package (supplier package: 672-FBGA, 27×27) with surface-mount construction for compact board integration.
• Power Supply Range  Core operating range from 870 mV to 980 mV to match system power-rail designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Arria 10 Architecture Features  Part of the Intel Arria 10 device family; device documentation highlights 20 nm architecture, embedded memory blocks, variable-precision DSP resources, clock networks with PLLs, and support for serial transceivers and PCIe hard IP within the Arria 10 series.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel cards and remote radio head modules that require a balance of logic density and on-chip memory.
• Wireline Networking  Line cards, muxponders and transponders where programmable logic and robust I/O enable packet processing and protocol bridging.
• Broadcast & Pro AV  Studio switches and media transport equipment benefiting from on-device buffering and flexible I/O.
• Computing & Storage  Server acceleration and flash cache controllers that use programmable logic and embedded RAM for low-latency tasks.
• Medical & Defense Systems  Diagnostic imaging and radar/control applications that require high logic resources and operation across an industrial temperature range.

Unique Advantages

• High programmable density: 160,000 logic elements enable complex control, signal processing and protocol implementations on a single device, reducing external component count.
• Substantial on-chip memory: 10,086,400 RAM bits provide local storage for buffering, FIFOs and lookup tables, improving throughput and latency for data-heavy tasks.
• Wide I/O capability: 240 I/O pins support multiple parallel interfaces and flexible board-level connectivity options.
• Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for systems exposed to extended temperature ranges.
• Compact FCBGA footprint: 672-ball (27×27) FCBGA package and surface-mount design simplify integration into dense PCBs and constrained form factors.
• Power configurability: Core supply window of 870 mV to 980 mV supports power-rail choices for optimized power consumption within the Arria 10 architecture.

Why Choose 10AX016E3F27I2LG?

The 10AX016E3F27I2LG positions itself as a high-capacity, mid-range FPGA option within the Intel Arria 10 family, combining substantial logic and memory resources with flexible I/O and an industrial temperature rating. It is suited for engineers building communication, compute acceleration, media processing or mission-critical systems that require on-chip resources and deterministic behavior across temperature extremes.

As part of the Arria 10 device family, this FPGA benefits from Intel's documented device features and design resources, enabling scalable designs that can leverage family-level capabilities such as embedded memory configurations, DSP resources and clocking/topology options.

If you would like pricing, availability or to request a quote for 10AX016E3F27I2LG, please submit a quote request or contact sales to discuss your design requirements and volume needs.