10AX016E3F29E1SG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 10086400 160000 780-BBGA, FCBGA

Quantity 728 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F29E1SG – Arria 10 GX FPGA, 780‑FBGA (29×29)

The 10AX016E3F29E1SG is an Intel Arria 10 GX series Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It is a 20‑nm mid‑range FPGA offering a balance of performance and power efficiency suitable for high‑performance, power‑sensitive applications.

Target use cases include wireless and wireline communications, broadcast and media processing, compute and storage acceleration, and other midrange systems that require significant programmable logic, on‑chip RAM, and dense I/O connectivity.

Key Features

  • Logic Capacity  160,000 logic elements provide substantial resources for complex digital designs and midrange FPGA implementations.
  • Configurable Logic Blocks  61,510 configurable logic blocks (CLBs) for flexible logic packing and routing.
  • Embedded Memory  10,086,400 total RAM bits of on‑chip memory to support buffering, caches, and intermediate data storage.
  • I/O Density  288 user I/O pins to support multiple interfaces and parallel data paths.
  • Power Supply  Core voltage range specified at 870 mV to 980 mV for compatibility with target power domains and efficient core operation.
  • Package & Mounting  780‑BBGA FCBGA (780‑FBGA, 29×29) surface‑mount package for high‑density board integration.
  • Operating Range  Extended grade operation from 0 °C to 100 °C suitable for many commercial and enterprise deployments.
  • Family Capabilities  As an Arria 10 device, the family provides features such as variable‑precision DSP blocks, embedded memory blocks, flexible clock networks and PLLs, and hard IP for high‑speed interfaces and PCIe Gen1/Gen2/Gen3.
  • Compliance  RoHS compliant for environmental requirements.

Typical Applications

  • Wireless Infrastructure  Channel cards, remote radio head electronics, and mobile backhaul systems that need programmable logic and DSP resources.
  • Wireline Networking  40G/100G line cards, muxponders, and aggregation equipment requiring high‑speed interfaces and programmable datapaths.
  • Broadcast & Media  Studio switching, video processing, and professional audio/video transport where low‑latency FPGA processing and on‑chip memory are beneficial.
  • Compute & Storage Acceleration  Server acceleration, flash cache controllers, and cloud compute offload that leverage logic density and embedded memory.
  • Medical & Imaging  Diagnostic scanners and imaging systems that require adaptable compute blocks and significant on‑chip RAM.

Unique Advantages

  • High Logic Density: 160,000 logic elements enable complex system functions to be integrated on a single device, reducing board count.
  • Significant On‑Chip Memory: Over 10 million bits of embedded RAM support large buffers and data‑flow intensive designs without external memory dependency.
  • Compact, High‑Density Package: The 780‑FBGA (29×29) package provides a small footprint while delivering 288 I/Os for dense interface integration.
  • Power‑Aware Operation: Core voltage specified between 870 mV and 980 mV supports efficient power management for midrange, power‑sensitive systems.
  • Extended Operating Range: 0 °C to 100 °C grade accommodates a wide set of commercial and enterprise environments.
  • Established FPGA Family: Arria 10 family features such as DSP blocks, embedded memory types, clock networks, and PCIe hard IP provide a mature ecosystem for design development.

Why Choose 10AX016E3F29E1SG?

The 10AX016E3F29E1SG combines substantial logic capacity, abundant on‑chip RAM, and dense I/O in a compact 780‑FBGA package, making it well suited for midrange applications that require programmable performance with attention to power efficiency. As part of the Intel Arria 10 GX family, it aligns with designs that benefit from variable‑precision DSPs, flexible clocking, and hardened interface IP.

Designers targeting wireless, wireline, broadcast, compute acceleration, or imaging applications will find the device's balance of logic, memory, I/O, and power characteristics helpful for building scalable, robust systems while leveraging the Arria 10 device ecosystem and documentation.

Request a quote or submit a pricing inquiry to evaluate the 10AX016E3F29E1SG for your next design project.

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