10AX016E3F29I1HG

The 10AX016E3F29I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It is part of the Arria 10 device family, a 20‑nm mid‑range FPGA family designed for high‑performance, power‑sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

This device integrates 160,000 logic elements, 10,086,400 bits of embedded RAM and 288 general‑purpose I/Os, delivering a balance of logic density, on‑chip memory and I/O capability for midrange system designs that require performance and power efficiency.

Key Features

• Logic Capacity — 160,000 logic elements for implementing complex digital logic and datapaths.
• Embedded Memory — 10,086,400 total RAM bits to support on‑chip buffering, caching and large‑state designs.
• I/O and Packaging — 288 I/Os in a 780‑FBGA (29×29) surface‑mount package (780‑BBGA, FCBGA) for dense board integration and broad connectivity.
• Power Supply — Core voltage range 870 mV to 980 mV to match system power rails and power‑management strategies.
• Industrial Temperature Range — Specified operation from −40 °C to 100 °C for robust performance in temperature‑sensitive environments.
• Arria 10 Family Features — Device family capabilities include variable‑precision DSP blocks, embedded memory block types, clock networks with PLL clock sources, PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet support, low‑power serial transceivers, and options for dynamic and partial reconfiguration.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel processing and remote radio head functions that require high logic density and on‑chip memory.
• Wireline and optical networking — Line cards and muxponders that benefit from integrated transceiver support and PCIe/packet processing capabilities.
• Broadcast and professional video — Video routing, switching and transport applications leveraging on‑chip RAM and DSP resources.
• Data center and compute acceleration — Server acceleration and cache buffering that use the device’s logic, memory and I/O mix.
• Medical and defense systems — Imaging, radar and secure communications where industrial temperature range and device family features are required.

Unique Advantages

• High logic density: 160,000 logic elements provide the capacity to implement large, complex designs without external logic expansion.
• Substantial on‑chip memory: 10,086,400 bits of embedded RAM reduce the need for external memory and improve data throughput and latency.
• Versatile I/O and packaging: 288 I/Os in a 780‑FBGA (29×29) package optimize board area and offer flexible connectivity for mixed‑signal and high‑speed designs.
• Designed for power‑sensitive applications: Core voltage range of 870–980 mV supports power management strategies across system designs.
• Broad system feature set (family level): Arria 10 family capabilities—DSP blocks, PLLs, hardened PCIe and high‑speed serial support—enable integrated solutions for networking, video and compute tasks.
• Industrial temperature rating: Operation from −40 °C to 100 °C extends deployment options into temperature‑challenging environments.

Why Choose 10AX016E3F29I1HG?

The 10AX016E3F29I1HG combines a midrange Arria 10 GX architecture with a practical balance of logic, memory and I/O to address performance‑focused, power‑sensitive designs. Its industrial temperature range and RoHS compliance make it suitable for applications that require reliability across varied environments.

Engineers selecting this device benefit from the Arria 10 family feature set—DSP resources, configurable clocking, hardened interface IP and reconfiguration capabilities—allowing scalable system designs that leverage a common device family and supporting documentation.

Request a quote or submit an inquiry for pricing and availability of 10AX016E3F29I1HG to evaluate it for your next midrange FPGA design.