10AX016E3F29I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 10086400 160000 780-BBGA, FCBGA |
|---|---|
| Quantity | 135 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 288 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 61510 | Number of Logic Elements/Cells | 160000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10086400 |
Overview of 10AX016E3F29I2LG – Arria 10 GX FPGA, 160,000 Logic Elements, 10,086,400 RAM bits, 288 I/Os
The 10AX016E3F29I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780-ball FCBGA package. It belongs to the Arria 10 device family of 20 nm mid-range FPGAs designed for high-performance, power-sensitive applications.
Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military systems where a balance of logic density, embedded memory, transceiver capability and power efficiency is required.
Key Features
- Core Logic 160,000 logic elements and 61,510 CLBs provide programmable logic capacity for complex digital designs.
- Embedded Memory 10,086,400 total RAM bits for on-chip buffering, caches and data-path storage.
- I/O and Package 288 I/O pins in a 780-BBGA (780-FBGA, 29×29) surface-mount package to support diverse external interfaces.
- Power Supply Supports a core voltage supply range of 870 mV to 980 mV for the device core.
- Operating Temperature Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- On‑Chip System Blocks Device family includes variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs to support signal processing and timing needs.
- High‑Speed Interfaces Arria 10 GX family documentation references low power serial transceivers, enhanced PCS hard IP for 10 Gbps Ethernet and PCIe hard IP options for Gen1/Gen2/Gen3.
- Configuration & Reliability Family-level features include dynamic and partial reconfiguration support and SEU error detection and correction frameworks as described in device documentation.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging programmable logic and transceiver support.
- Wireline networking 40G/100G muxponders, transponders and line cards where embedded memory and high-speed serial interfaces are required.
- Broadcast and media Studio switches and video/transport processing that benefit from FPGA-based packet handling and real-time processing.
- Computing and storage acceleration Flash cache, cloud server acceleration and compute offload using the device’s logic capacity and on-chip memory.
- Medical and defense Diagnostic imaging, radar and electronic warfare subsystems that require programmable processing and industrial temperature operation.
Unique Advantages
- High logic density: 160,000 logic elements and 61,510 CLBs enable integration of large functions on a single device, reducing board-level complexity.
- Substantial on‑chip RAM: 10,086,400 RAM bits provide headroom for buffering, frame storage and data-path acceleration without relying solely on external memory.
- Flexible I/O and packaging: 288 I/Os in a compact 780-ball FCBGA (29×29) package support multiple interface standards and compact board layouts.
- Industrial temperature range: Rated operation from −40 °C to 100 °C supports deployment in harsh or thermally demanding systems.
- Power-aware operation: Family-level emphasis on power efficiency and a specified core voltage range (870 mV–980 mV) help designs meet system power budgets.
- System integration features: On-chip DSP blocks, PLLs, clock networks and documented high-speed serial hard IP reduce external component count and accelerate time to market.
Why Choose 10AX016E3F29I2LG?
This Arria 10 GX FPGA balances significant programmable logic, large embedded RAM and robust I/O in a single industrial-temperature package, making it suitable for mid-range systems that require both performance and power sensitivity. The device family’s documented features—DSP resources, clocking and serial/PCIe hard IP—help system designers consolidate functionality and streamline board-level design.
For engineers and procurement teams building wireless, wireline, broadcast, compute/storage or mission-critical systems, the 10AX016E3F29I2LG offers a validated FPGA option with the capacity and system-level features described in Intel’s Arria 10 device documentation.
Request a quote to check availability, lead times and pricing for the 10AX016E3F29I2LG and discuss how it fits your next FPGA-based design.

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