10AX016E4F27E3SG

The 10AX016E4F27E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672‑ball FCBGA package. It is a 20‑nm mid‑range FPGA device designed for applications that require substantial logic capacity, embedded memory, and flexible I/O in a compact surface‑mount package.

Built for markets such as wireless, wireline, broadcast, computing and storage, medical, and defense systems, this device targets mid‑range, high‑performance designs that benefit from a balance of logic density, on‑chip RAM, and a high I/O count.

Key Features

• Core Logic  160,000 logic elements and 61,510 logic blocks provide programmable fabric for complex digital designs.
• Embedded Memory  10,086,400 total RAM bits of on‑chip memory to support buffers, caches, and lookup tables without external RAM.
• I/O and Packaging  240 user I/O pins in a surface‑mount 672‑BBGA (672‑FBGA, 27×27) package for dense board integration and high‑pin designs.
• Power  Core voltage range specified at 0.870 V to 0.930 V, enabling low‑voltage operation for the FPGA core.
• Thermal and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in controlled industrial and commercial environments.
• Compliance  RoHS‑compliant construction.

Typical Applications

• Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and memory are needed for PHY and MAC processing.
• High‑speed wireline networking  40G/100G muxponders, transponders, and 100G line cards that require high logic density and plentiful I/O for packet processing and interface aggregation.
• Broadcast and media  Studio switches, videoconferencing, and professional audio/video systems that need programmable data paths and on‑chip buffering.
• Computing and storage  Server acceleration, flash cache controllers, and cloud compute offloads that leverage embedded RAM and programmable logic for custom data processing.
• Medical and defense electronics  Diagnostic imaging, radar, electronic warfare, and guidance systems that benefit from configurable logic and on‑chip memory resources.

Unique Advantages

• High logic capacity: 160,000 logic elements enable implementation of complex state machines, custom accelerators, and large control fabrics.
• Substantial on‑chip memory: Over 10 million bits of embedded RAM reduce dependence on external memory for many buffer and cache functions.
• Generous I/O in a compact package: 240 I/Os in a 672‑ball FCBGA provide a high pin count while maintaining a small board footprint.
• Low core voltage operation: 0.870–0.930 V core supply supports designs optimized for lower power at the FPGA core.
• Extended temperature grade: Rated 0 °C to 100 °C to meet a range of commercial and industrial deployment conditions.
• RoHS compliant: Environmentally compliant construction suitable for regulated supply chains.

Why Choose 10AX016E4F27E3SG?

The 10AX016E4F27E3SG positions itself as a mid‑range Arria 10 GX FPGA offering a mix of high logic density, significant embedded memory, and a high I/O count in a compact 672‑BBGA package. These characteristics make it suitable for designers building mid‑to‑high complexity systems that require on‑chip resources to minimize external components and simplify board design.

For teams developing wireless and wireline infrastructure, broadcast equipment, compute acceleration, or advanced medical and defense electronics, this device delivers a verified Arria 10 platform with clear electrical and thermal specifications to guide integration and system planning.

Request a quote or submit your procurement inquiry to receive pricing and availability details for the 10AX016E4F27E3SG.