10AX016E3F29I2SG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 10086400 160000 780-BBGA, FCBGA

Quantity 102 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F29I2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 288 I/O, 160,000 Logic Elements

The 10AX016E3F29I2SG is an Intel Arria 10 GX family FPGA in a 780‑FBGA (29×29) package, offering mid-range 20‑nm FPGA architecture optimized for performance and power efficiency. With 160,000 logic elements, 10,086,400 total RAM bits and 288 I/O pins, this device is targeted at high-performance, power‑sensitive applications across wireless, wireline, broadcast, computing, and medical markets.

Key Features

  • Core Logic 160,000 logic elements for implementing complex digital logic, state machines and custom accelerators.
  • On‑chip Memory 10,086,400 total RAM bits of embedded memory to support large buffering, packet handling and user memory structures.
  • I/O and Packaging 288 general purpose I/O pins in a 780‑FBGA (29×29) package (package case listed as 780‑BBGA, FCBGA / supplier device package 780‑FBGA), enabling dense board integration.
  • Power Supply Core voltage supply range of 870 mV to 980 mV to match system power rails and enable power-optimized designs.
  • Operating Range Industrial grade operating temperature from −40 °C to 100 °C for deployment in temperature‑challenging environments.
  • High‑level Architecture Features Arria 10 family capabilities include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks with PLL sources, and support for dynamic and partial reconfiguration.
  • High‑speed Interfaces and IP Device family documentation highlights low‑power serial transceivers, 10 Gbps Ethernet support and PCIe Gen1/2/3 hard IP for common high‑speed system interfaces.
  • Reliability and Management Series features referenced in the device overview include SEU error detection and correction, power management and configuration options for robust system operation.
  • Compliance RoHS compliant; grade listed as Industrial.

Typical Applications

  • Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems, leveraging the device’s programmable logic and DSP capabilities.
  • Wireline Networking 40G/100G muxponders, transponders and line cards where high‑speed interfaces and embedded memory are required for packet processing and aggregation.
  • Broadcast and Professional AV Studio switches, transport and videoconferencing equipment that benefit from configurable logic and high I/O density.
  • Computing and Storage Cloud computing servers, flash cache and server acceleration designs that use FPGA logic and on‑chip memory to accelerate workloads.
  • Medical Imaging and Diagnostics Diagnostic scanners and imaging systems that require configurable processing blocks and deterministic I/O control.

Unique Advantages

  • Highly integrated programmable fabric: 160,000 logic elements combined with large on‑chip memory enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Balance of performance and power efficiency: Arria 10 family design emphasizes higher performance than previous mid‑range devices while including power‑saving technologies for energy‑sensitive systems.
  • Rich interface and IP support: Family features such as serial transceivers, 10 Gbps Ethernet support and PCIe hard IP simplify implementation of common high‑speed links.
  • Flexible deployment range: Industrial operating temperature (−40 °C to 100 °C) and standard FBGA packaging support deployment in demanding environments.
  • Advanced system features: Support for dynamic and partial reconfiguration, clocking resources and SEU detection/correction provides design flexibility and improved robustness.
  • Vendor ecosystem and documentation: Part of the Intel Arria 10 device family with device‑level documentation and design resources referenced in the device overview.

Why Choose 10AX016E3F29I2SG?

The 10AX016E3F29I2SG positions itself as a mid‑range Arria 10 GX FPGA delivering a practical balance of programmable logic density (160,000 logic elements), substantial embedded memory (10,086,400 bits) and extensive I/O (288 pins) in a 780‑FBGA package. Its industrial temperature rating and core voltage range make it suitable for robust, power‑sensitive designs across communications, broadcast, computing and medical applications.

For teams seeking a field‑programmable solution with integrated DSP resources, configurable clocking and high‑speed interface capabilities (as outlined in the Arria 10 device overview), this device provides a scalable platform backed by Intel’s Arria 10 family documentation and design guidance.

Request a quote or submit an inquiry to get pricing, availability and lead‑time information for the 10AX016E3F29I2SG.

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