10AX016E3F29I1SG

The 10AX016E3F29I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 780‑ball BGA FCBGA package, targeted at mid-range, performance-sensitive applications. It combines a high logic capacity and embedded memory with low-power architectural features described for the Arria 10 device family.

Typical market uses for Arria 10 devices include wireless infrastructure, wireline optical systems, broadcast/pro AV, computing and storage, and medical and defense applications where performance and power efficiency are important design considerations.

Key Features

• Core architecture  Arria 10 GX device family architecture implemented in this part, delivering the family-level performance and power-efficiency attributes described in the Arria 10 overview.
• Logic capacity  160,000 logic elements (cells) to implement complex digital logic and control functions.
• Embedded memory  10,086,400 total RAM bits of on-chip memory to support buffers, FIFOs, and packet/stream processing.
• I/O and package  288 device I/O pins in a 780‑BBGA (780‑FBGA, 29×29) FCBGA package, surface-mount compatible for production PCBs.
• Power supply  Supported core voltage range of 870 mV to 980 mV for core power domains.
• Operating range and grade  Industrial temperature rating from −40 °C to 100 °C and RoHS compliant.
• Device-level features (Arria 10 family)  Family-level features noted in the device overview include variable-precision DSP blocks, embedded memory blocks, clock networks with PLL sources, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for serial protocols such as Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.

Typical Applications

• Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and embedded memory for signal processing.
• Wireline and optical networking  Line cards, muxponders, and transponders for 40G/100G applications using on-chip transceiver and protocol hard IP support.
• Broadcast and professional AV  Studio switches and video transport equipment that benefit from large on-chip RAM and flexible I/O.
• Computing and storage  Cloud servers, flash cache accelerators, and server offload functions utilizing the device’s logic resources and memory capacity.
• Medical and defense systems  Diagnostic imaging and radar/secure communications applications requiring industrial temperature operation and substantial logic and memory resources.

Unique Advantages

• High logic density: 160,000 logic elements enable implementation of complex algorithms and multi-function designs on a single device.
• Substantial on-chip memory: 10,086,400 total RAM bits reduce external memory dependence for buffering and streaming tasks.
• Flexible I/O and packaging: 288 I/O in a 780‑ball FCBGA (29×29) package supports dense board integration and a wide range of I/O assignments.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Power-domain compatibility: Core supply support from 870 mV to 980 mV aligns with Arria 10 family power architectures for optimized power management.
• Standards-enabled feature set: Family-level support for PCIe Gen1/Gen2/Gen3, serial protocol PCS, and low-power transceivers simplifies implementation of high-speed interfaces.

Why Choose 10AX016E3F29I1SG?

The 10AX016E3F29I1SG positions Arria 10 GX device-family capabilities—high logic capacity, large embedded memory, and family-level serial and protocol hard IP—in a production-ready 780‑ball FCBGA package with industrial temperature rating. It is suited to mid-range, performance- and power-sensitive designs where on-chip resources and reliable operation across a wide temperature window matter.

For engineers and procurement teams building network, compute, broadcast, medical, or defense systems, this part provides a balance of integration and flexibility that supports scalable designs while leveraging the Arria 10 device overview feature set and documented device guidance.

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