10AX016E4F27E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,262 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 61510 | Number of Logic Elements/Cells | 160000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10086400 |
Overview of 10AX016E4F27E3LG – Arria 10 GX FPGA, 160,000 logic elements, 10,086,400 RAM bits, 240 I/O, 672‑FBGA (27×27)
The 10AX016E4F27E3LG is an Intel Arria 10 GX field programmable gate array (FPGA) IC designed for mid‑range, performance‑oriented applications. It is part of the Arria 10 family of 20 nm devices and delivers a balance of computational density and power efficiency for applications that require substantial programmable logic, embedded memory, and flexible I/O.
Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military applications where higher performance and power efficiency are required. This device combines a large logic fabric with extensive embedded RAM and high I/O count in a 672‑FBGA surface‑mount package with an extended operating grade.
Key Features
- Logic Capacity The device provides 160,000 logic elements to implement complex digital functions and custom accelerators.
- Embedded Memory 10,086,400 total RAM bits of on‑chip memory for buffering, FIFOs, and implemented memory structures.
- I/O Resources 240 general‑purpose I/O pins to support a wide range of peripherals and external interfaces.
- Package and Mounting Surface‑mount 672‑BBGA / FCBGA device; supplier device package specified as 672‑FBGA (27×27) for compact system integration.
- Power Supply Range Core supply voltage from 870 mV to 930 mV to match system power rails and device requirements.
- Operating Range and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in temperature‑controlled environments.
- Family‑Level Capabilities Arria 10 family features documented include advanced clock networks, fractional synthesis and I/O PLLs, dynamic and partial reconfiguration, and support for high‑speed serial transceivers and PCIe/10 Gbps Ethernet hard IP (as described in Arria 10 device documentation).
- Compliance RoHS compliant.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul implementations that benefit from programmable logic and embedded memory.
- Wireline networking 40G/100G muxponders, transponders, and line cards where programmable interfaces and high‑speed serial capabilities are required.
- Broadcast and media Studio switches, video transport, and professional audio/video processing workflows that require custom logic and buffering.
- Computing and storage Cloud servers, flash cache, and server acceleration tasks that leverage FPGA acceleration and on‑chip memory.
- Medical and defense Diagnostic imaging, radar, and electronic warfare systems that require configurable logic and robust performance.
Unique Advantages
- High programmable capacity: 160,000 logic elements provide headroom for complex designs and multi‑function integration on a single device.
- Large on‑chip memory: 10,086,400 RAM bits reduce external memory dependence for buffering and data‑path functions.
- Robust I/O integration: 240 I/O pins simplify connection to peripherals, memories, and high‑speed interfaces.
- Family feature set: Arria 10 documented features—such as advanced clocking, reconfiguration options, and high‑speed serial and protocol hard IP—enable flexible system architectures.
- Compact system footprint: 672‑FBGA (27×27) surface‑mount package supports dense board layouts while providing required I/O and thermal characteristics.
- Documented support: Backed by Intel Arria 10 device documentation and datasheets for design guidance and implementation details.
Why Choose 10AX016E4F27E3LG?
The 10AX016E4F27E3LG Arria 10 GX FPGA is positioned for designers who need a balance of programmable logic density, substantial embedded RAM, and flexible I/O in a single, surface‑mount package. Its extended grade and defined power and thermal parameters make it suitable for systems that require predictable operation within the specified ranges.
Customers building mid‑range, performance‑sensitive applications will find the device useful for consolidating functions, accelerating workloads, and enabling configurable interfaces—all supported by the Arria 10 family documentation and technical resources.
If you would like pricing, availability, or a formal quote for 10AX016E4F27E3LG, please request a quote or submit an inquiry and our team will respond with the next steps.

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