10AX016E4F27E3LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA

Quantity 1,262 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E4F27E3LG – Arria 10 GX FPGA, 160,000 logic elements, 10,086,400 RAM bits, 240 I/O, 672‑FBGA (27×27)

The 10AX016E4F27E3LG is an Intel Arria 10 GX field programmable gate array (FPGA) IC designed for mid‑range, performance‑oriented applications. It is part of the Arria 10 family of 20 nm devices and delivers a balance of computational density and power efficiency for applications that require substantial programmable logic, embedded memory, and flexible I/O.

Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military applications where higher performance and power efficiency are required. This device combines a large logic fabric with extensive embedded RAM and high I/O count in a 672‑FBGA surface‑mount package with an extended operating grade.

Key Features

  • Logic Capacity  The device provides 160,000 logic elements to implement complex digital functions and custom accelerators.
  • Embedded Memory  10,086,400 total RAM bits of on‑chip memory for buffering, FIFOs, and implemented memory structures.
  • I/O Resources  240 general‑purpose I/O pins to support a wide range of peripherals and external interfaces.
  • Package and Mounting  Surface‑mount 672‑BBGA / FCBGA device; supplier device package specified as 672‑FBGA (27×27) for compact system integration.
  • Power Supply Range  Core supply voltage from 870 mV to 930 mV to match system power rails and device requirements.
  • Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in temperature‑controlled environments.
  • Family‑Level Capabilities  Arria 10 family features documented include advanced clock networks, fractional synthesis and I/O PLLs, dynamic and partial reconfiguration, and support for high‑speed serial transceivers and PCIe/10 Gbps Ethernet hard IP (as described in Arria 10 device documentation).
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul implementations that benefit from programmable logic and embedded memory.
  • Wireline networking  40G/100G muxponders, transponders, and line cards where programmable interfaces and high‑speed serial capabilities are required.
  • Broadcast and media  Studio switches, video transport, and professional audio/video processing workflows that require custom logic and buffering.
  • Computing and storage  Cloud servers, flash cache, and server acceleration tasks that leverage FPGA acceleration and on‑chip memory.
  • Medical and defense  Diagnostic imaging, radar, and electronic warfare systems that require configurable logic and robust performance.

Unique Advantages

  • High programmable capacity: 160,000 logic elements provide headroom for complex designs and multi‑function integration on a single device.
  • Large on‑chip memory: 10,086,400 RAM bits reduce external memory dependence for buffering and data‑path functions.
  • Robust I/O integration: 240 I/O pins simplify connection to peripherals, memories, and high‑speed interfaces.
  • Family feature set: Arria 10 documented features—such as advanced clocking, reconfiguration options, and high‑speed serial and protocol hard IP—enable flexible system architectures.
  • Compact system footprint: 672‑FBGA (27×27) surface‑mount package supports dense board layouts while providing required I/O and thermal characteristics.
  • Documented support: Backed by Intel Arria 10 device documentation and datasheets for design guidance and implementation details.

Why Choose 10AX016E4F27E3LG?

The 10AX016E4F27E3LG Arria 10 GX FPGA is positioned for designers who need a balance of programmable logic density, substantial embedded RAM, and flexible I/O in a single, surface‑mount package. Its extended grade and defined power and thermal parameters make it suitable for systems that require predictable operation within the specified ranges.

Customers building mid‑range, performance‑sensitive applications will find the device useful for consolidating functions, accelerating workloads, and enabling configurable interfaces—all supported by the Arria 10 family documentation and technical resources.

If you would like pricing, availability, or a formal quote for 10AX016E4F27E3LG, please request a quote or submit an inquiry and our team will respond with the next steps.

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