10AX016E4F27I3LG

The 10AX016E4F27I3LG is an Intel Arria 10 GX field-programmable gate array supplied in a 672-BBGA (27×27) FCBGA package for surface-mount assembly. It is a 20 nm mid-range FPGA device family member designed for applications that require a balance of performance and power efficiency across communications, broadcast, computing, medical, and defense markets.

With 160,000 logic elements, 10,086,400 bits of on-chip RAM, and 240 I/O, this device targets high-performance, power-sensitive designs that need dense logic, embedded memory, and flexible I/O in an industrial-temperature rated package.

Key Features

• Core Architecture  Adaptive logic modules and a 20 nm FPGA fabric provide the basis for programmable logic and mid-range performance.
• Logic Capacity  160,000 logic elements to implement complex custom logic, control functions, or acceleration tasks.
• On‑chip Memory  10,086,400 total RAM bits of embedded memory for large buffering, state storage, and data-path requirements.
• I/O and Packaging  240 I/O pins in a 672-BBGA (672-FBGA, 27×27) FCBGA package; surface-mount mounting type suited to high-density boards.
• Power  Core supply range 870 mV to 930 mV for the FPGA core domain as specified.
• Thermal and Reliability  Industrial operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• FPGA Subsystem Features  Family-level features called out in the device overview include variable-precision DSP blocks, embedded memory blocks, PLL and clock network options, and serial transceiver support for high-speed interfaces.
• Configuration and Reconfiguration  Device documentation indicates support for dynamic and partial reconfiguration modes at the family level, enabling in-field design updates and segmented reprogramming.
• Standards and Integration  Datasheet references family hard IP blocks such as PCIe and enhanced PCS hard IP for high-speed interfaces (series-level capability listed in the device overview).
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch cards, remote radio heads and mobile backhaul designs that require programmable DSP and logic resources.
• Wireline and Networking  Line cards, muxponders and transponders, and aggregation or bridging applications leveraging embedded memory and high-speed serial capabilities.
• Broadcast and Media  Studio switches, video transport and professional audio/video processing where programmable logic and on-chip RAM help implement custom data paths.
• Computing and Storage Acceleration  Flash cache, server acceleration, and cloud computing applications that benefit from offloadable logic and memory resources.
• Medical and Defense Systems  Diagnostic imaging, radar, and secure communications systems that require deterministic programmability and industrial temperature operation.

Unique Advantages

• Balanced performance and efficiency: The 20 nm Arria 10 family architecture delivers mid-range FPGA performance with family-level power-saving technologies referenced in the device overview.
• Substantial on-chip memory: Over 10 Mbits of embedded RAM allows large buffers and deep packet/stream handling without external memory for many use cases.
• High logic density: 160,000 logic elements provide the capacity to integrate complex control, DSP, and custom accelerators on a single device.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Integrated high-speed subsystem options: Series documentation lists PLLs, clock networks, DSP blocks, and serial transceiver/PCS hard IP—helping simplify high-speed interface design.
• Standard surface-mount package: 672-BBGA (27×27) FCBGA package enables high-density PCB integration and established assembly flows.

Why Choose 10AX016E4F27I3LG?

The 10AX016E4F27I3LG combines a mid-range, 20 nm Arria 10 FPGA architecture with substantial logic and memory resources, industrial-temperature operation, and a compact 672-BBGA package. It is positioned for engineers who need programmable acceleration, flexible I/O, and on-chip memory in applications across communications, broadcast, computing, medical, and defense markets.

Choosing this device supports designs that require scalable logic capacity, significant embedded RAM, and family-level features such as DSP blocks and high-speed serial capabilities, while preserving deployment flexibility through surface-mount packaging and a wide operating temperature range.

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