10AX016E3F29E1HG

The 10AX016E3F29E1HG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package. It is a 20‑nm mid‑range FPGA family device targeted at high‑performance, power‑sensitive applications across communications, broadcast, computing, medical, and defense markets.

This device delivers a balanced combination of programmable logic resources, embedded memory, and high I/O density—designed for use cases that require significant on‑chip RAM, a large number of logic elements, and flexible I/O in a compact surface‑mount package.

Key Features

• Logic Capacity  160,000 logic elements (cells) to implement complex digital logic, state machines, and custom datapaths.
• Embedded Memory  10,086,400 total RAM bits for large on‑chip buffering, caches, or frame storage.
• I/O Density  288 I/O pins to support broad external interfacing and multi‑lane connectivity.
• Power Supply  Core supply range 870 mV to 980 mV to match system power rails and voltage budgeting.
• Package & Mounting  780‑BBGA (FCBGA) surface‑mount package; supplier package 780‑FBGA (29 × 29 mm) for high‑density board layouts.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications in controlled‑environment and industrial‑adjacent systems.
• Environmental Compliance  RoHS compliant.
• Arria 10 Family Capabilities  As an Arria 10 device, the family offers features such as variable‑precision DSP blocks, embedded memory blocks, fractional synthesis and I/O PLLs, PCIe Gen1/Gen2/Gen3 hard IP, and low‑power serial transceivers (family features described in the Intel Arria 10 documentation).

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment that need programmable logic and on‑chip memory.
• High‑Speed Wireline  40G/100G muxponders, transponders, and aggregation line cards that require flexible I/O and programmable datapaths.
• Broadcast and Professional AV  Studio switches and video processing systems that benefit from large on‑chip RAM and high logic density.
• Computing and Storage  Flash cache acceleration and server offload functions where dense logic and embedded memory reduce external component count.
• Medical and Imaging  Diagnostic imaging and scanner subsystems that require programmable processing blocks and substantial local memory.

Unique Advantages

• High programmable density: 160,000 logic elements enable complex custom logic and parallel processing without immediate reliance on external ASICs.
• Large on‑chip memory: Over 10 million RAM bits provide substantial local buffering and reduce latency compared with off‑chip memory for many workloads.
• Broad external connectivity: 288 I/Os in a compact BGA package allow dense board routing and multiple interface lanes to external systems.
• Compact, surface‑mount packaging: 780‑ball FCBGA (29 × 29 mm supplier outline) balances thermal and PCB real‑estate requirements forembedded designs.
• Designed for power‑sensitive mid‑range designs: Family‑level power efficiency and a defined core voltage range (870–980 mV) assist system power budgeting.
• Extended operating grade: 0 °C to 100 °C rating supports deployment in environments requiring wider commercial/extended thermal tolerance.

Why Choose 10AX016E3F29E1HG?

The 10AX016E3F29E1HG positions itself for designs that need a high number of logic elements, significant embedded RAM, and a high I/O count in a single compact surface‑mount FPGA. As part of the Intel Arria 10 family, it leverages mid‑range 20‑nm FPGA architecture aimed at balancing performance and power efficiency for communications, compute acceleration, imaging, and broadcast applications.

For teams building systems that require scalable programmable logic, on‑chip memory capacity, and flexible interfacing in a production‑orientated BGA package, this device provides a verifiable specification set and environmental compliance suitable for many commercial and industrial‑adjacent designs.

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