10AX016E3F27I2SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA

Quantity 46 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs61510Number of Logic Elements/Cells160000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits10086400

Overview of 10AX016E3F27I2SG – Arria 10 GX FPGA, 672‑BBGA, 240 I/O

The 10AX016E3F27I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) IC designed for midrange, performance‑sensitive applications. It is built on the Arria 10 device family architecture and benefits from the device family's 20 nm heritage targeting higher performance and improved power efficiency.

Typical markets and use cases for this device include wireless infrastructure, wireline and data‑center networking, broadcast and media processing, computing and storage acceleration, medical imaging, and defense applications where industrial temperature range and on‑chip integration are required.

Key Features

  • Logic Capacity 160,000 logic elements (cells) provide programmable fabric for complex digital logic implementations and custom accelerators.
  • Embedded Memory 10,086,400 total RAM bits for on‑chip buffering, packet buffering, and data staging without immediate external memory dependence.
  • I/O and Package 240 user I/O pins in a 672‑BBGA FCBGA package (supplier package: 672‑FBGA, 27×27) with surface‑mount mounting for compact board designs.
  • Power Supply Low‑voltage core operation supported at 870 mV to 980 mV, enabling lower power operation in power‑sensitive systems.
  • Industrial Temperature Rated for −40 °C to 100 °C and listed as Industrial grade for deployment in IT and industrial environments requiring extended temperature range.
  • High‑Speed Interfaces (Device Family Features) Arria 10 device family features include low‑power serial transceivers and hard IP blocks such as PCIe Gen1/2/3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, enabling high‑bandwidth I/O implementations.
  • DSP and Architecture (Device Family Features) Adaptive logic modules and variable‑precision DSP blocks for arithmetic‑intensive workloads and signal processing functions.
  • Standards and Compliance RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high‑speed serial links are required.
  • Wireline Networking 40G/100G muxponders, transponders, and line cards that benefit from on‑chip buffering, transceivers, and hard IP for high‑speed protocols.
  • Broadcast & Media Processing Studio switches and real‑time video processing applications that require low‑latency processing and sizable on‑chip memory.
  • Compute & Storage Acceleration Flash cache controllers, server acceleration, and cloud compute offload where programmable logic and DSP resources accelerate workloads.
  • Medical & Defense Systems Diagnostic imaging, radar, and electronic warfare subsystems that use the device’s logic density, DSP blocks, and industrial temperature rating.

Unique Advantages

  • Substantial On‑Chip Logic: 160,000 logic elements enable integration of complex custom logic, protocol handling, and acceleration engines on a single device.
  • Large Embedded Memory: Over 10 million RAM bits reduce reliance on external memory for buffering and intermediate data storage, simplifying board design and improving performance.
  • Compact, High‑Density Packaging: 672‑BBGA FCBGA (27×27 mm) provides high pin density and a surface‑mount footprint suited to space‑constrained systems.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial and harsh environment applications.
  • Low‑Voltage Core Operation: 0.87–0.98 V supply range supports power‑sensitive designs and helps reduce overall system power consumption.
  • Built‑in High‑Speed I/O and IP: Device‑family hard IP for PCIe and high‑speed serial protocols plus low‑power transceivers accelerate implementation of networking and storage interfaces.

Why Choose 10AX016E3F27I2SG?

The 10AX016E3F27I2SG delivers a balance of logic density, embedded memory, and I/O capability drawn from the Intel Arria 10 device family. Its combination of 160,000 logic elements, more than 10 million bits of on‑chip RAM, and support for high‑speed serial interfaces makes it well suited for midrange applications that require performance and power efficiency within a compact package.

This device is targeted at engineers and system designers building wireless infrastructure, networking equipment, broadcast/video processing, compute/storage accelerators, and industrial or defense systems that require programmable flexibility, DSP resources, and an extended operating temperature range. Leveraging Arria 10 family features helps reduce board complexity and supports scalable designs across similar application classes.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for the 10AX016E3F27I2SG.

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