10AX016E3F27E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 10086400 160000 672-BBGA, FCBGA |
|---|---|
| Quantity | 405 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 61510 | Number of Logic Elements/Cells | 160000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10086400 |
Overview of 10AX016E3F27E2LG – Arria 10 GX FPGA, 672-BBGA
The 10AX016E3F27E2LG is an Intel Arria 10 GX family Field Programmable Gate Array (FPGA) in a 672-ball FCBGA (27×27) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs designed for applications that require high logic density and embedded memory.
Key on-board resources include 160,000 logic elements, 10,086,400 total RAM bits, and 240 I/O pins. The device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where performance and power efficiency are important.
Key Features
- Logic Density Provides 160,000 logic elements to implement complex digital functions and custom processing blocks.
- Embedded Memory Total RAM capacity of 10,086,400 bits for on-chip data buffering, lookup tables, and state storage.
- I/O Capability 240 programmable I/O pins to support diverse digital interfaces and board-level connectivity.
- Package & Mounting 672-BBGA FCBGA (27×27) surface-mount package for high-density PCB integration and thermal conduction.
- Power Supply Core voltage range 870 mV to 980 mV to match modern low-voltage FPGA power architectures.
- Operating Range Extended grade with an operating temperature range of 0°C to 100°C for many commercial and embedded environments.
- Compliance RoHS compliant.
- Arria 10 Family Capabilities Series-level features include high performance and power-efficiency characteristics, and support materials such as device handbooks and errata/design recommendations for development and deployment.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and embedded memory.
- Wireline networking Line cards, muxponders, and transponders (example uses include 40G/100G aggregation and bridging) leveraging the device's logic and I/O.
- Broadcast and Pro AV Studio switches, video processing, and transport functions where on-chip memory and logic density support real-time media pipelines.
- Computing and storage Server acceleration and flash cache controllers that use FPGA resources for offload and custom datapath implementations.
- Medical and defense systems Diagnostic imaging, radar, and secure-communications subsystems that can benefit from programmable logic and embedded memory.
Unique Advantages
- High integration: 160,000 logic elements combined with over 10 million RAM bits reduce the need for external logic and memory, simplifying board-level design.
- Broad I/O support: 240 I/O pins accommodate multiple interfaces and high pin-count system connections without external multiplexing.
- Compact, manufacturable package: 672-ball FCBGA (27×27) surface-mount package enables dense PCB layouts and is compatible with standard assembly processes.
- Low-voltage core compatibility: Core supply range of 870–980 mV aligns with modern low-power supply architectures to help manage overall system power.
- Extended temperature suitability: Rated 0°C to 100°C for a wide set of commercial and embedded applications where extended temperature operation is required.
- Documented platform: Part of the Arria 10 family with available device handbook and errata/design recommendation documents to support development and risk mitigation.
Why Choose 10AX016E3F27E2LG?
The 10AX016E3F27E2LG offers a compelling balance of logic capacity, embedded memory, and I/O density in a single 672-BBGA package, making it suitable for mid-range designs that need programmable acceleration, protocol bridging, or real-time processing. As a member of the Intel Arria 10 family, it benefits from series-level documentation and design guidance to streamline development.
This device is appropriate for engineering teams and procurement groups building commercial and embedded systems in wireless, wireline, broadcast, computing, medical, and defense markets that require scalable programmable logic and on-chip memory resources backed by vendor documentation.
Request a quote or submit an RFQ to begin procurement and evaluation of the 10AX016E3F27E2LG for your next design.

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