10AX027E2F29E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 97 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E2F29E1SG – Arria 10 GX Field Programmable Gate Array (FPGA)
The 10AX027E2F29E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 780-BBGA FCBGA package. It delivers a balance of high logic capacity, on-chip memory, and I/O density for mid-range, performance-sensitive applications.
As part of the Arria 10 device family, this device targets markets such as wireless infrastructure, wireline communications, broadcast, computing and storage, medical imaging, and defense systems, offering performance and power-efficiency advantages associated with the Arria 10 architecture.
Key Features
- Logic Capacity — 270,000 logic elements suitable for complex digital designs and high-density programmable functions.
- On‑chip Memory — 17,870,848 total RAM bits to support large buffers, caches, and embedded data structures.
- High I/O Count — 360 I/O pins for wide external connectivity to memory, peripherals, and high-speed interfaces.
- Package and Mounting — 780-BBGA FCBGA package (supplier package: 780-FBGA 29×29) optimized for surface-mount assembly.
- Power and Operating Range — Core supply range 870 mV to 980 mV and operating temperature 0 °C to 100 °C; available in Extended grade.
- Arria 10 Family Architecture — Includes Arria 10 features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, and support for dynamic and partial reconfiguration.
- High‑speed Interface Support — Family-level support for PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, plus low-power serial transceivers and configurable transceiver channels.
- System Integration — Arria 10 devices include features for FPGA configuration, SEU error detection and correction, and power management as part of the device family capabilities.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging the device’s logic density and embedded memory.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards where high-speed serial interfaces and PCIe support are required.
- Broadcast and Professional AV — Studio switches, transport, and video processing applications that benefit from large on-chip memory and flexible I/O.
- Compute and Storage Acceleration — Server acceleration, flash cache, and cloud computing functions that use DSP blocks and partial reconfiguration for workload optimization.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications that require a combination of logic resources, memory, and extended-grade operation.
Unique Advantages
- High Logic Density: 270,000 logic elements enable implementation of complex algorithms and high-throughput data paths without external logic.
- Significant Embedded Memory: 17,870,848 bits of on-chip RAM reduce reliance on external memory for buffering and real-time processing.
- Extensive I/O: 360 I/O pins provide the flexibility to interface with multiple external devices and high-speed links.
- Compact, Surface‑Mount Package: 780-FBGA (29×29) package offers a dense, manufacturable footprint for high-performance systems.
- Low-Voltage Core Operation: Core supply from 870 mV to 980 mV enables compatibility with low-voltage system rails and power-optimized designs.
- Arria 10 Family Capabilities: Family-level features—DSP blocks, PLLs, hard IP for PCIe and high-speed Ethernet, and configuration options—support versatile system integration and long-term design scalability.
Why Choose 10AX027E2F29E1SG?
The 10AX027E2F29E1SG positions itself as a mid-range Arria 10 GX FPGA that combines large logic resources, substantial embedded memory, and broad I/O in a compact BGA package. Its extended-grade rating and defined operating range make it suitable for commercial and industrial-style systems that require sustained performance within 0 °C to 100 °C.
Design teams targeting wireless, networking, broadcast, compute acceleration, medical imaging, or defense applications can leverage the Arria 10 family’s architecture—DSP capabilities, embedded memory, configurable transceivers, and hardened interface IP—to accelerate development and scale designs while relying on Intel’s device documentation and family-level support.
Request a quote or submit a product inquiry for pricing and availability of the 10AX027E2F29E1SG.

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