10AX027E2F29I1HG

The 10AX027E2F29I1HG is an Intel Arria 10 GX field programmable gate array packaged in a 780‑ball FCBGA (29×29) surface‑mount package. It is part of the Arria 10 family of 20‑nm mid‑range FPGAs and SoCs and targets applications that require a balance of performance, integration and power efficiency.

This device provides a large implementation capacity with 270,000 logic elements, 17,870,848 bits of embedded RAM and 360 I/O pins, and is specified for industrial operation from −40 °C to 100 °C with a core supply range of 870 mV to 980 mV.

Key Features

• Logic Capacity – 270,000 logic elements for complex digital designs and high-density implementations.
• On‑chip Memory – 17,870,848 total RAM bits of embedded memory to support large buffering, caching and state storage within the FPGA fabric.
• I/O and Package – 360 I/O pins in a 780‑BBGA (FCBGA) 29×29 surface‑mount package for dense board integration and plentiful external connectivity.
• Voltage and Thermal – Core voltage specified from 870 mV to 980 mV and operating temperature range −40 °C to 100 °C for industrial environments.
• Series Capabilities (Arria 10) – Series-level features include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, PLL clocking resources and support for high‑speed serial transceivers and PCIe hard IP (as described in the Arria 10 device overview).
• Mounting and Compliance – Surface mount FCBGA package; RoHS compliant.

Typical Applications

• Wireless Infrastructure – Channel processing and switch card implementations in baseband and remote radio head systems where FPGA fabric and DSP resources accelerate signal processing tasks.
• High‑speed Wireline – Line cards, muxponders and transponder functions in 40G/100G modules that require embedded memory and high I/O density.
• Broadcast and Media – Video and audio processing, studio switching and transport applications leveraging large logic capacity and on‑chip RAM.
• Computing and Acceleration – Server acceleration, flash cache controllers and cloud compute offload where programmable logic and DSP blocks provide application‑specific throughput improvements.

Unique Advantages

• High implementation density: 270,000 logic elements provide headroom for complex state machines, large custom accelerators and multi‑function designs.
• Large on‑chip memory: Nearly 18 Mbits of embedded RAM reduces external memory dependence for buffering and intermediate storage, simplifying board design.
• Robust industrial operation: Specified for −40 °C to 100 °C operation and RoHS compliance to support deployment in industrial environments.
• Rich I/O in compact package: 360 I/Os in a 780‑BBGA FCBGA package enables dense connectivity for high‑pin‑count systems without excessive board area.
• Series‑level system features: Arria 10 family capabilities such as DSP blocks, PLLs and transceiver support provide a flexible platform for signal processing and high‑speed interfaces.

Why Choose 10AX027E2F29I1HG?

The 10AX027E2F29I1HG Arria 10 GX FPGA combines substantial logic capacity, large embedded RAM and extensive I/O in a 780‑ball FCBGA package, making it suitable for mid‑range applications that need a balance of performance and integration. Its industrial temperature rating and RoHS compliance make it appropriate for demanding deployments where environmental range and regulatory compliance matter.

Design teams targeting wireless infrastructure, high‑speed wireline, broadcast/media processing and server acceleration can leverage the Arria 10 series features to implement signal processing, protocol offload and custom acceleration while keeping board-level complexity manageable.

If you would like pricing or availability, request a quote or submit an inquiry to receive further technical and procurement assistance for part number 10AX027E2F29I1HG.