10AX027E2F29I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 481 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E2F29I2LG – Arria 10 GX FPGA, 780‑BBGA FCBGA
The 10AX027E2F29I2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) supplied in a 780‑ball FCBGA package. It combines a high logic capacity and large embedded memory with mid‑range, power‑efficient 20 nm device architecture to address demanding communications, compute and industrial designs.
Well suited for markets such as wireless, wireline, broadcast, computing and storage, and medical imaging, this industrial‑grade device targets applications that require substantial logic, extensive on‑chip RAM, and a broad set of I/O in a compact surface‑mount package.
Key Features
- Programmable Logic Provides 270,000 logic elements for implementing complex custom logic and control algorithms.
- Embedded Memory Includes 17,870,848 total RAM bits to support frame buffers, FIFOs and on‑chip data storage for high‑throughput designs.
- I/O Capacity 360 user I/O pins available for interfacing with external memory, transceivers and peripherals.
- Power and Voltage Operates from core supply voltages between 870 mV and 980 mV to match system power rails and support efficient power delivery.
- Package and Mounting 780‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 780‑FBGA, FC (29×29) for compact board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet harsh‑environment requirements.
- Arria 10 Family Capabilities Family documentation highlights features such as variable‑precision DSP blocks, embedded memory blocks, fractional synthesis and I/O PLLs, PCIe Gen1/Gen2/Gen3 hard IP, and low‑power serial transceivers (series‑level features referenced from Arria 10 device overview).
- Surface Mount Designed for standard surface‑mount assembly processes for automated production.
- RoHS Compliant Meets RoHS environmental requirements.
Typical Applications
- Wireless Infrastructure Channel cards, remote radio head control and mobile backhaul modules that need programmable logic and on‑chip memory.
- Wireline and Transport 40G/100G line cards, muxponders and transponders where dense logic and PCIe or high‑speed serial interfaces are required.
- Broadcast and Pro AV Studio switching, video transport and professional audio/video processing leveraging large embedded RAM for buffering and frame handling.
- Compute and Storage Acceleration Flash cache, server acceleration and cloud compute functions that benefit from high logic density and programmable acceleration blocks.
- Medical and Imaging Diagnostic scanners and imaging pipelines that require deterministic processing and substantial on‑chip memory.
Unique Advantages
- High Logic Density: 270,000 logic elements support complex custom logic and control functions without external ASICs.
- Large On‑Chip Memory: 17,870,848 RAM bits reduce dependence on external memory for many buffering and data‑path tasks.
- Broad I/O Count: 360 I/Os enable multiple interfaces and external memory connections while preserving board routing flexibility.
- Industrial Reliability: Rated for −40 °C to 100 °C operation for sustained performance in demanding environments.
- Compact Packaging: 780‑BBGA / 780‑FBGA (29×29) footprint balances high pin count with a compact board area for space‑constrained designs.
- Family Ecosystem: Part of the Intel Arria 10 device family, with documented family‑level features such as DSP blocks, PLLs and PCIe hard IP to accelerate system implementation.
Why Choose 10AX027E2F29I2LG?
The 10AX027E2F29I2LG positions itself as a mid‑range, high‑capacity FPGA for designs that demand substantial programmable logic, abundant embedded memory and a large set of I/O in an industrial‑rated package. It is aimed at engineers and procurement teams building communications, compute acceleration, broadcast and medical imaging systems that benefit from the Arria 10 family’s balance of performance and power efficiency.
Backed by Intel’s Arria 10 device documentation and family features, this device provides a scalable, supported FPGA option for projects that require long‑term availability and robust technical resources during development and production.
Request a quote or submit a procurement inquiry to receive pricing, availability and lead‑time information for the 10AX027E2F29I2LG.

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