10AX027E3F27E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA |
|---|---|
| Quantity | 204 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E3F27E2SG – Arria 10 GX FPGA, 672‑BBGA, 240 I/O
The 10AX027E3F27E2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) offered in a 672‑ball BGA package. As a member of the Arria 10 family of 20‑nm mid‑range FPGAs, this device targets high‑performance, power‑sensitive midrange applications across communications, broadcast, computing, medical, and defense markets.
This part provides a large programmable fabric alongside substantial on‑chip memory and a broad I/O complement, enabling complex logic implementation, memory buffering, and interfacing in a compact surface‑mount FCBGA (27 × 27 mm) package.
Key Features
- High logic capacity — 270,000 logic elements for implementing large-scale digital designs and complex algorithms.
- Embedded memory — 17,870,848 total RAM bits to support on‑chip data storage, buffering, and packet processing functions.
- Rich I/O — 240 I/O pins to connect multiple interfaces, memory devices, and high‑speed links directly to the FPGA fabric.
- Advanced device architecture — Arria 10 family features including adaptive logic modules, variable‑precision DSP blocks, and embedded memory blocks as described in the device documentation.
- Transceiver and interface support — Family documentation references low‑power serial transceivers, PCS/PMA features, and hard IP blocks such as PCIe Gen1/2/3 and enhanced PCS for high‑speed networking.
- Package and mounting — 672‑BBGA (FCBGA) surface‑mount package, supplier package 672‑FBGA, FC (27 × 27 mm) for high I/O density in compact board layouts.
- Power rails — Core voltage supply range of 870 mV to 930 mV, enabling targeted power design and regulation.
- Operating range and grade — Extended grade device with an operating temperature range of 0°C to 100°C.
Typical Applications
- Wireless infrastructure — Channel and switch cards or mobile backhaul functions that require programmable logic and on‑chip memory for filtering, packet handling, and control.
- Wireline and optical networking — 40G/100G line cards, muxponders, and transponders that use embedded memory and high‑speed interface IP for aggregation and transport.
- Broadcast and professional AV — Studio switches and video processing where large logic capacity and on‑chip RAM enable format conversion, routing, and buffering.
- Computing and storage acceleration — Server acceleration, flash cache, and cloud server offload tasks leveraging DSP blocks and large programmable fabric.
- Medical and defense systems — Diagnostic imaging, radar, and signal processing applications that require flexible hardware acceleration and substantial on‑chip memory.
Unique Advantages
- Scalable programmable fabric: 270,000 logic elements provide the headroom to implement complex custom logic, accelerators, and protocol stacks without immediate redesign.
- Large embedded memory: Nearly 17.9 Mb of on‑chip RAM reduces external memory dependence for buffering and state storage, simplifying BOM and board routing.
- High‑density I/O in a compact package: 240 I/O pins delivered in a 672‑BBGA (27 × 27 mm) package enable dense system integration while keeping board area small.
- Targeted power specification: Core voltage range of 0.87 V to 0.93 V supports focused power budgeting and regulation strategies.
- Extended operating range: The 0°C to 100°C operating range and extended grade classification offer deterministic behavior across typical commercial to extended‑range environments.
- Family‑level feature set: Arria 10 device documentation highlights DSP blocks, flexible memory architectures, PCIe hard IP, and low‑power transceivers that help accelerate system design.
Why Choose 10AX027E3F27E2SG?
The 10AX027E3F27E2SG positions itself as a high‑capacity, midrange Arria 10 GX FPGA suitable for designs that demand large programmable logic, substantial embedded memory, and a wide complement of I/O in a compact surface‑mount package. Its extended grade and documented family features make it appropriate for communications, broadcast, computing, and signal‑processing applications where integration and on‑chip resources reduce system complexity.
Designers benefit from the Arria 10 family ecosystem and Intel’s device documentation when developing hardware and firmware, enabling scalable designs that can leverage the device’s DSP, memory, and transceiver capabilities while managing power and board integration requirements.
Request a quote or submit an inquiry for availability, lead times, and volume pricing to evaluate 10AX027E3F27E2SG for your next design.

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