10AX027E3F27E2LG

The 10AX027E3F27E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672‑ball FCBGA surface‑mount package. It belongs to the Arria 10 family of 20‑nm mid‑range FPGAs designed for higher performance and improved power efficiency.

With 270,000 logic elements, 17,870,848 total RAM bits and 240 I/O, this device targets midrange designs that require substantial on‑chip logic and memory capacity within a compact 27×27 mm package. The device is offered in an extended grade and operates from 0 °C to 100 °C, with a core supply range of 870 mV to 930 mV.

Key Features

• Core Capacity 270,000 logic elements to implement complex midrange FPGA designs.
• Embedded Memory 17,870,848 total RAM bits of on‑chip memory for buffers, FIFOs, and embedded storage.
• I/O and Packaging 240 user I/Os delivered in a 672‑BBGA/FCBGA (672‑FBGA, 27×27) supplier package for compact board integration.
• Power and Supply Core voltage supply specified from 870 mV to 930 mV for regulated power design.
• Temperature Range & Grade Extended grade device rated for 0 °C to 100 °C operating temperature.
• Family‑Level Capabilities As part of the Intel Arria 10 family, the device benefits from 20‑nm architecture attributes cited in family documentation, including embedded memory blocks, variable‑precision DSP resources, clock networks and PLLs, serial transceiver support, and hardened protocol IP options referenced in Arria 10 device materials.
• Compliance RoHS compliant to meet environmental requirements.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require on‑chip logic density and memory.
• Wireline networking — Line cards, muxponders and transponders for 40G/100G systems and aggregation where midrange FPGA performance is needed.
• Broadcast and media — Studio switches, transport and professional audio/video processing leveraging embedded memory and DSP resources.
• Computing and storage — Server acceleration, flash cache, and cloud computing server applications that benefit from high logic and memory integration.
• Medical and defense systems — Imaging, radar and secure communications where a balance of performance and power efficiency is required.

Unique Advantages

• High logic density: 270,000 logic elements enable integration of substantial custom logic without immediate reliance on multiple devices.
• Significant on‑chip memory: Nearly 18 million bits of embedded RAM reduce external memory requirements for buffering and local storage.
• Compact system footprint: 672‑ball FCBGA (27×27) packaging and 240 I/Os provide dense connectivity in a board‑space efficient form factor.
• Power‑aware 20‑nm architecture: Family documentation highlights performance gains and power efficiency achieved in the Arria 10 devices, supporting power‑sensitive midrange applications.
• Extended operating range: Extended grade and 0 °C to 100 °C operation accommodate designs with broader environmental requirements.
• Standards‑aware platform: Family materials call out support for common interfaces and hardened IP options useful in networking, transceiver and memory interface designs.

Why Choose 10AX027E3F27E2LG?

The 10AX027E3F27E2LG places Arria 10 GX capabilities into a highly integrated 672‑ball FCBGA package, combining substantial logic and embedded memory with a practical I/O count for complex midrange systems. Its extended grade rating and defined supply and temperature ranges make it suitable for commercial and enterprise applications that require reliable on‑device resources and predictable power design.

Design teams building wireless infrastructure, networking, broadcast, server acceleration or medical/defense systems can use this device to consolidate functionality, reduce board complexity and leverage the Arria 10 family feature set as documented in Intel’s device materials.

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