10AX027E2F29I2SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA

Quantity 213 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E2F29I2SG – Arria 10 GX FPGA, 270,000 Logic Elements

The 10AX027E2F29I2SG is an Arria 10 GX field-programmable gate array (FPGA) device in a 780‑BBGA (FCBGA 29×29) package. It is part of the Intel Arria 10 family of 20‑nm mid-range FPGAs designed for high-performance, power-efficient implementations.

Targeted markets and use cases for the Arria 10 family include wireless and wireline infrastructure, broadcast, computing and storage, medical imaging and defense applications. The device combines large logic and memory resources with a broad set of system-level features for mid-range, performance-sensitive applications.

Key Features

  • Logic Capacity  270,000 logic elements providing ample programmable fabric for complex digital functions and algorithm implementation.
  • Embedded Memory  17,870,848 total RAM bits to support on-chip buffering, frame storage and data-path acceleration.
  • I/O and Package  360 I/O pins in a 780‑BBGA (FCBGA 29×29) surface-mount package for high-density board integration and routing flexibility.
  • Power Supply  Core voltage range 870 mV to 980 mV to match system power-rail requirements for Arria 10 devices.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation and classified as Industrial grade for use in temperature-demanding environments.
  • Arria 10 Family System Features  Family-level features include adaptive logic modules, variable-precision DSP blocks, comprehensive embedded memory types, clock networks with PLLs, and support for dynamic/partial reconfiguration.
  • High‑Speed Serial and Protocol Support  Arria 10 family documentation notes low‑power serial transceivers, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and PCIe Gen1/Gen2/Gen3 hard IP options for common high-speed interfaces.
  • Mounting and Supplier Package  Surface-mount FCBGA 780 package (supplier device package: 780‑FBGA, FC 29×29) for established board-assembly processes.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul implementations that require programmable signal processing and packet handling.
  • Wireline Communications  Line cards, muxponders and transponders (40G/100G) where high-speed serial interfaces and programmable logic accelerate protocol processing.
  • Broadcast and Video  Studio switches, transport and videoconferencing equipment that benefit from embedded memory and DSP resources for video frame buffering and processing.
  • Computing and Storage  Server acceleration, flash cache and cloud computing servers using on-chip logic and memory to offload compute- or data-path tasks.
  • Medical and Defense Systems  Diagnostic imaging, radar and guidance-control applications that require robust, industrial-temperature FPGA platforms.

Unique Advantages

  • Substantial On‑Chip Logic and Memory: 270,000 logic elements paired with 17.87 Mb of RAM bits enables complex algorithms and sizable buffering on a single device, reducing external memory dependence.
  • Industrial Temperature and Packaging: Industrial-grade rating and a 780‑BBGA surface-mount package simplify deployment in temperature-challenging and space-constrained systems.
  • Broad System-Level Capability: Family-level features such as DSP blocks, PLL-based clock networks and partial reconfiguration support provide design flexibility for varied mid-range applications.
  • High I/O Density: 360 configurable I/O pins support diverse peripheral and high-speed interface requirements without additional bridge components.
  • Protocol and Transceiver Support (Family): Arria 10 family documentation includes support for high-speed serial protocols and hard IP for PCIe and 10 Gbps Ethernet, enabling streamlined integration of common interfaces.
  • Vendor Documentation and Errata: The Arria 10 device overview and associated handbook/errata provide reference material for design guidance and known-issue tracking.

Why Choose 10AX027E2F29I2SG?

The 10AX027E2F29I2SG Arria 10 GX device delivers a balanced combination of large programmable logic capacity, significant on-chip memory, and extensive I/O in an industrial-temperature, surface-mount 780‑BBGA package. It is suited to mid-range, performance-sensitive applications that require both compute density and system-level feature sets provided by the Arria 10 family.

Design teams seeking a flexible FPGA platform for wireless and wireline infrastructure, broadcast, compute acceleration, medical imaging or defense electronics will find this device aligns performance, integration and operating-temperature requirements while relying on the Arria 10 family documentation for implementation guidance.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the 10AX027E2F29I2SG Arria 10 GX FPGA.

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