10AX027E2F29I1SG

The 10AX027E2F29I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package. It belongs to the Arria 10 family of 20 nm mid-range FPGAs designed for high-performance, power-sensitive applications across multiple markets.

With 270,000 logic elements, 17,870,848 bits of on-chip RAM and 360 I/Os, this device targets midrange applications requiring substantial logic capacity, embedded memory and broad connectivity, while supporting industrial temperature operation.

Key Features

• Logic Capacity — 270,000 logic elements provide substantial programmable resources for complex digital designs.
• Embedded Memory — 17,870,848 total RAM bits of on-chip memory to support buffering, packet processing and data staging on-chip.
• I/O Density — 360 general-purpose I/O pins for wide external interfacing and system integration.
• Power Supply — Specified supply voltage range of 0.870 V to 0.980 V for core operation.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package — 780-BBGA / 780-FBGA (29×29) surface-mount package for compact system-level integration.
• Family Capabilities — Part of the Intel Arria 10 family (20 nm) that emphasizes higher performance and power-efficiency; family-level features include embedded memory configurations, clock networks and serial/transceiver capabilities.
• Compliance — RoHS compliant.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul implementations leveraging on-chip logic and I/O for signal processing and interface control.
• Wireline Networking — 40G/100G muxponders, transponders and line cards where programmable logic and embedded memory handle high-throughput packet processing and bridging functions.
• Broadcast and Media — Studio switches, video transport and professional audio/video processing that require flexible I/O and on-chip buffering.
• Computing and Storage — Server acceleration, flash cache and cloud infrastructure applications that use FPGA logic and memory for data-path offload and caching functions.
• Medical and Military Systems — Diagnostic imaging, radar and secure communications that benefit from the device’s logic capacity and industrial temperature rating.

Unique Advantages

• High Logic Density: 270,000 logic elements enable implementation of complex algorithms and multi-function systems on a single device.
• Substantial On-Chip Memory: Nearly 18 Mb of embedded RAM reduces external memory dependencies and supports high-bandwidth local buffering.
• Extensive I/O Count: 360 I/Os give designers flexibility to connect multiple interfaces and peripherals without external multiplexing.
• Industrial Temperature Capability: −40 °C to 100 °C rating supports deployment in harsher environments and industrial equipment.
• Compact, Surface-Mount Packaging: 780-FBGA (29×29) supports high-density board layouts and system-level integration.
• Part of a Mature Family: As an Arria 10 device, it leverages family-level features and documentation for design guidance and system optimization.

Why Choose 10AX027E2F29I1SG?

The 10AX027E2F29I1SG balances high logic capacity, significant embedded memory and broad I/O in a compact industrial-temperature FBGA package. It is positioned for midrange, performance- and power-sensitive designs across communications, broadcast, computing, medical and defense markets.

Choosing this Arria 10 GX device provides a scalable platform for complex, memory-intensive and I/O-rich applications, supported by Intel’s Arria 10 family documentation and device-level guidance to help accelerate system design and deployment.

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