10AX027E3F29E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 540 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E3F29E2SG – Arria 10 GX FPGA, 780-BBGA FCBGA
The 10AX027E3F29E2SG is an Intel Arria 10 GX field-programmable gate array supplied in a 780-ball FCBGA package for surface-mount assembly. This device is part of the Arria 10 family of 20 nm mid-range FPGAs and is engineered for midrange, performance-sensitive applications that require significant logic capacity and on-chip memory.
Key value propositions include a large logic resource set, abundant embedded RAM, and dedicated I/O and transceiver capabilities described at the device-family level in the datasheet—making the part suitable for high-throughput communications, networking, and compute-acceleration tasks within the stated electrical and thermal operating ranges.
Key Features
- Logic Capacity — 270,000 logic elements suitable for complex, high-density digital designs.
- Embedded Memory — 17,870,848 total RAM bits to support large on-chip buffering, caching, and data-path storage.
- I/O and Package — 360 user I/O pins in a 780-ball BGA (FCBGA) package; surface-mount mounting type and supplier package 780-FBGA, FC (29×29).
- Voltage and Power — Core voltage supply range specified at 870 mV to 930 mV, enabling regulated core operation within defined limits.
- Operating Temperature — Rated for 0 °C to 100 °C ambient operation (Grade: Extended).
- Family-Level IP and Interfaces — Arria 10 family documents indicate availability of hard IP such as PCIe Gen1/Gen2/Gen3 and high-speed serial/transceiver support and protocol IP relevant to 10 Gbps Ethernet and Interlaken (family-level features).
- Design and Reconfiguration — Family datasheet references dynamic and partial reconfiguration and power-management features (family-level capabilities described in datasheet).
Typical Applications
- Telecommunications and Networking — Use the device for line cards, mux/ponders, or packet-processing functions where high logic density and embedded memory enable protocol handling and buffering.
- Data Center and Acceleration — Implement server acceleration and flash-caching functions that benefit from large on-chip RAM and significant logic resources.
- Broadcast and Video — Deploy in video transport, professional video switching, and encoding/decoding front-ends that require flexible I/O and substantial logic for stream processing.
- Instrumentation and Medical Imaging — Integrate into imaging and diagnostic equipment requiring extensive logic and memory for signal processing pipelines.
Unique Advantages
- Substantial Logic Resources: 270,000 logic elements provide headroom for large-scale FPGA designs without immediate need for multiple devices.
- Large On-Chip RAM: Nearly 17.9 Mbits of embedded RAM supports deep buffering and high-throughput data paths, reducing external memory dependency.
- Robust I/O Count in a Compact Package: 360 I/O pins in a 780-BBGA (29×29) format balance connectivity with a compact board footprint for surface-mount assembly.
- Family-Level High-Speed Interfaces: The Arria 10 family includes hard IP for PCIe Gen1/2/3 and transceiver capabilities suited to multi-gigabit links, enabling integration of standard high-speed interfaces.
- Operational Range Matched to System Environments: Core voltage range of 870–930 mV and 0 °C to 100 °C operating temperature provide clear electrical and thermal bounds for system design and thermal planning.
Why Choose 10AX027E3F29E2SG?
This Arria 10 GX FPGA variant combines high logic density, substantial embedded memory, and a generous I/O complement in a 780-ball FCBGA package, delivering a capable platform for midrange, performance-oriented designs. It is well-suited to customers building communications, compute-acceleration, and media-processing systems that require on-chip resources and family-provided hard IP to streamline implementation.
Choosing this part brings the advantages of the Arria 10 device family—20 nm process benefits and documented family-level features—while providing a clear electrical and thermal specification set for integration into production designs where these exact parameters align with system requirements.
Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the 10AX027E3F29E2SG. Technical purchasing details and volume quotes are available upon request.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018