10AX027E4F27E3LG

The 10AX027E4F27E3LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a surface-mount 672-FBGA package. It belongs to the 20 nm Arria 10 device family designed for mid-range, high-performance and power-sensitive applications.

This device combines high logic capacity, substantial embedded RAM, and a broad set of system-level features from the Arria 10 family to address applications across wireless, wireline, broadcast, computing and medical markets where performance and power efficiency matter.

Key Features

• Core architecture  Arria 10 GX family device based on a 20 nm mid-range FPGA architecture, delivering the performance and power-efficiency characteristics described for the Arria 10 family.
• Logic capacity  270,000 logic elements (cells) to implement complex digital logic and control functions.
• Embedded memory  17,870,848 total RAM bits for on-chip buffering, frame storage, and accelerator working memory.
• I/O  240 device I/O pins to interface with external memory, peripherals, and high-speed PHYs.
• High-speed connectivity options  Series-level features include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
• DSP and compute blocks  Includes variable-precision DSP block support (series feature) for arithmetic-heavy and signal-processing tasks.
• Package & mounting  Surface-mount 672-FBGA (FCBGA) package, supplier device package listed as 672-FBGA, FC (27×27).
• Power  Supported core voltage supply range: 870 mV to 980 mV.
• Operating range & grade  Extended temperature grade with an operating range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require mid-range FPGA performance and power efficiency.
• Wireline networking  40G/100G muxponders, transponders, line cards and bridging/aggregation applications leveraging high-speed serial connectivity.
• Broadcast and professional AV  Studio switches, transport, and videoconferencing equipment that benefit from embedded memory and programmable logic for custom signal flows.
• Computing and storage  Flash cache, cloud server acceleration and server-side processing tasks where on-chip RAM and DSP capability accelerate workloads.
• Medical and defense systems  Diagnostic imaging, radar, and secure communications that require configurable logic, embedded memory and deterministic processing.

Unique Advantages

• High logic and memory density: 270,000 logic elements and 17,870,848 RAM bits enable large, integrated designs on a single device, reducing external component count.
• Integrated high-speed IP: Built-in support for PCIe Gen1/2/3 and enhanced PCS for Interlaken and 10 Gbps Ethernet streamlines connectivity implementation.
• Flexible compute for signal processing: Variable-precision DSP blocks (series feature) allow tailored arithmetic performance for mixed-precision workloads.
• Compact, surface-mount package: 672-FBGA (27×27) packaging supports dense board-level integration in space-constrained systems.
• Power-focused operation: Core supply range of 870–980 mV supports the Arria 10 family’s emphasis on power efficiency for mid-range designs.
• Extended operating range and compliance: Extended grade temperature range (0 °C to 100 °C) and RoHS compliance support deployment across a variety of commercial environments.

Why Choose 10AX027E4F27E3LG?

The 10AX027E4F27E3LG places Arria 10 GX family capabilities—high logic density, abundant embedded memory, DSP resources and high-speed connectivity—into a 672-FBGA package suited for mid-range, performance-sensitive designs. It is positioned for customers who need a balance of compute density and power efficiency in markets such as wireless infrastructure, networking, broadcast, and computing.

Using the Arria 10 device family’s architectural features, this part supports integration of substantial logic, memory and I/O on a single device, helping reduce BOM complexity and accelerate time-to-market for scalable designs.

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