10AX027E4F27I3LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA

Quantity 944 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E4F27I3LG – Arria 10 GX FPGA, 270,000 logic elements

The 10AX027E4F27I3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) device in a 672-ball FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs described in the device overview.

This device combines high logic capacity, substantial on-chip RAM, and a dense I/O count to address mid-range, performance-sensitive applications across wireless, wireline, broadcast, computing, medical and related markets. The Arria 10 family is described as delivering higher performance and power efficiency compared with previous-generation mid-range devices.

Key Features

  • Device Variant — Arria 10 GX family member, offering the Arria 10 architecture and device-level features referenced in the device overview.
  • Logic Capacity — 270,000 logic elements, providing a large fabric for implementing complex mid-range designs.
  • Embedded Memory — 17,870,848 total RAM bits of on-chip memory to support buffering, caching, and local storage.
  • I/O — 240 device I/O pins to support a wide range of external interfaces and peripherals.
  • Package & Mounting — 672-BBGA (FCBGA) package, supplier package listed as 672-FBGA, FC (27×27); surface-mount device.
  • Power Supply — Core/operating voltage range specified at 870 mV to 980 mV.
  • Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C.
  • On-device Architecture Features — Arria 10 devices include architectural elements called adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, and a comprehensive clocking network (as described in the device overview).
  • Connectivity & Hard IP — The Arria 10 family documentation references PCIe Gen1/Gen2/Gen3 hard IP and support features for high-speed serial protocols and Ethernet (as described in the device overview).
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where on-chip logic and memory support signal processing and control functions.
  • Wireline networking — 40G/100G muxponders, transponders, and line cards where the device’s logic density and I/O enable packet processing and aggregation tasks.
  • Broadcast and professional AV — Studio switches and video transport applications that require flexible I/O and on-chip buffering for media streams.
  • Computing and storage acceleration — Flash cache, server acceleration, and cloud compute roles that leverage embedded RAM and DSP resources for workload offload.
  • Medical and industrial imaging — Diagnostic imaging and scanner electronics that benefit from the industrial temperature range and high logic/memory capacity.

Unique Advantages

  • High logic density: 270,000 logic elements enable implementation of complex mid-range designs without immediate need for external logic expansion.
  • Substantial on-chip RAM: 17,870,848 bits of embedded memory reduce dependency on external memory for buffering and local data storage.
  • Broad I/O capability: 240 I/O pins support multiple interfaces and parallel connectivity for system integration.
  • Industrial operational range: −40 °C to 100 °C rating and industrial grade designation suit temperature-demanding deployments.
  • Dense, surface-mount packaging: 672-ball FCBGA (27×27) provides a compact, board-mountable form factor for space-constrained systems.
  • Arria 10 family features: Architecture-level resources such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks and supported hard IP options provide a flexible foundation for diverse mid-range applications.

Why Choose 10AX027E4F27I3LG?

The 10AX027E4F27I3LG places a high-capacity Arria 10 GX device in a compact 672-BBGA package with industrial temperature rating and RoHS compliance. Its combination of 270,000 logic elements, nearly 18 million bits of embedded RAM, and 240 I/O make it suitable for mid-range, performance-sensitive applications that require substantial on-chip resources and reliable operation across −40 °C to 100 °C.

As part of the Intel Arria 10 family, this device aligns with the documented device overview and design guidance for mid-range FPGA deployments, offering a platform appropriate for wireless, wireline, broadcast, computing, and medical systems that need integrated logic, memory, and connectivity options.

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