10AX027E4F27I3SG

The 10AX027E4F27I3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672‑ball FCBGA package. It is a 20‑nm mid‑range FPGA family member designed for performance and power efficiency in applications that require substantial programmable logic, embedded memory, and flexible I/O.

This device targets high‑performance, power‑sensitive midrange markets including wireless, wireline, broadcast, computing and storage, medical, and defense/secure communications applications where dense logic, on‑chip RAM, and robust transceiver/IO options are required.

Key Features

• Logic Capacity — 270,000 logic elements (logic cells) for complex programmable logic and control functions.
• On‑Chip Memory — 17,870,848 total RAM bits to support large buffering, caching, and embedded data structures.
• I/O Density — 240 user I/O pins to support broad interfacing needs with peripherals and external devices.
• Package & Mounting — 672‑BBGA (FCBGA) supplier device package (672‑FBGA, FC 27×27) with surface‑mount mounting suitable for dense board designs.
• Power Supply — Core voltage supply range from 870 mV to 980 mV, enabling integration into controlled power architectures.
• Operating Temperature — Industrial temperature range of −40 °C to 100 °C for deployment in temperature‑varying environments.
• Series‑Level Capabilities — Arria 10 family features described in the device overview include variable‑precision DSP blocks, embedded memory blocks and configurations, clock networks with PLL sources, low‑power serial transceivers, and hard IP for protocols such as PCIe and 10 Gbps Ethernet.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP resources handle signal processing and framing.
• Wireline networking — 40G/100G muxponders, transponders and 100G line cards for aggregation and protocol bridging using high‑speed transceivers and hard IP.
• Broadcast and professional AV — Studio switches, transport and videoconferencing equipment that require flexible I/O and embedded memory for stream buffering and format conversion.
• Computing and storage — Flash cache, server acceleration and cloud computing server functions that leverage high logic density and on‑chip RAM.
• Medical and defense systems — Diagnostic imaging and radar/electronic warfare subsystems that need industrial temperature operation and significant programmable logic resources.

Unique Advantages

• High logic density: 270,000 logic elements enable complex algorithms and multi‑function designs to be implemented on a single device, reducing board count.
• Substantial embedded memory: 17.87 million RAM bits provide large on‑chip storage for buffering, LUTs, and data processing without relying solely on external memory.
• Flexible interfacing: 240 I/O pins and a 672‑ball FCBGA package support diverse peripheral connections and high‑pin‑count board layouts.
• Industrial operating range: −40 °C to 100 °C qualification supports deployment in demanding temperature environments.
• Power‑tuned core: Core voltage range of 870–980 mV supports efficient power budgeting and integration into regulated power domains.
• Series capabilities: Arria 10 family features—such as DSP blocks, PLL clocking, low‑power serial transceivers, and protocol hard IP—provide a broad foundation for system designs that require these functions.

Why Choose 10AX027E4F27I3SG?

The 10AX027E4F27I3SG positions itself as a high‑capacity, mid‑range FPGA offering a balance of programmable logic, on‑chip memory, and industrial operating range. Its 270,000 logic elements and extensive RAM make it suitable for designers building performance‑oriented, power‑sensitive systems across communications, computing, broadcast, medical, and defense markets.

Choosing this Arria 10 GX device supports scalable designs that leverage the Arria 10 family’s series‑level features—DSP resources, clocking flexibility, and transceiver/hard IP options—while providing long‑term value through a dense, industrial‑rated package and defined power/temperature envelopes.

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