10AX027E3F29I2SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA

Quantity 554 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E3F29I2SG – Arria 10 GX FPGA IC, 270,000 logic elements, 780-BBGA

The 10AX027E3F29I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device built on a 20 nm mid-range architecture. It delivers a balance of high logic density, embedded memory, and advanced I/O suited for performance-sensitive, power-conscious designs.

Targeted at midrange applications across communications, broadcast, computing, medical, and defense markets, this industrial-grade FPGA provides the integration and on-chip resources needed to implement complex datapaths, high-speed interfaces, and flexible system-level functions.

Key Features

  • Logic Capacity — 270,000 logic elements for implementing substantial digital logic, state machines, and custom accelerators.
  • On-chip Memory — 17,870,848 total RAM bits to support large buffers, packet queues, and embedded data storage without external memory for many functions.
  • I/O and High-speed Interfaces — 360 general-purpose I/O pins and support for low-power serial transceivers and enhanced PCS hard IP including 10 Gbps Ethernet and Interlaken, enabling high-bandwidth links and protocol hard IP.
  • Hard IP for System Connectivity — Device family documentation includes PCIe Gen1/Gen2/Gen3 hard IP and Ethernet/Interlaken support for common high-speed system interfaces.
  • DSP and Clocking — Variable-precision DSP blocks plus comprehensive clock networks, PLL clock sources, and fractional synthesis/I/O PLLs for precise timing and signal processing.
  • Configuration and Reliability — Supports dynamic and partial reconfiguration, SEU error detection and correction, and integrated power management features described for the Arria 10 family.
  • Package and Mounting — 780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-FBGA, FC (29×29), simplifying high-density board integration.
  • Power and Temperature — Core supply voltage range 870 mV–930 mV and industrial operating temperature range −40 °C to 100 °C for extended-environment deployment.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment, where on-chip DSP, transceivers, and logic density enable modem and fronthaul implementations.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards that require high-speed serial links, protocol hard IP, and large on-chip buffering.
  • Broadcast and Media — Studio switching, signal routing, and video processing applications leveraging abundant logic and embedded memory for real-time media pipelines.
  • Computing and Storage Acceleration — Flash cache, server acceleration, and cloud compute offloads that use the device’s logic, memory, and fast I/O to implement custom acceleration engines.
  • Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare functions that benefit from high logic capacity, deterministic processing, and industrial temperature range.

Unique Advantages

  • High integration density: 270,000 logic elements and 17,870,848 RAM bits enable large, complex designs without excessive external components.
  • Robust I/O and protocol support: 360 I/O pins plus hard IP for PCIe and multi-gigabit Ethernet/Interlaken reduce development time for common high-speed interfaces.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environments where thermal resilience is required.
  • Advanced signal processing: Variable-precision DSP blocks and flexible clocking PLLs support a wide range of DSP and timing-sensitive functions.
  • Compact, board-friendly package: 780-BBGA (780-FBGA, FC 29×29) surface-mount package provides a high-density footprint suitable for space-constrained PCBs.
  • Power-aware 20 nm platform: Part of the Arria 10 family engineered for higher performance and improved power efficiency relative to prior mid-range generations.

Why Choose 10AX027E3F29I2SG?

The 10AX027E3F29I2SG Arria 10 GX FPGA is positioned for engineers who need a midrange FPGA with substantial logic and embedded memory, strong I/O capabilities, and industrial temperature tolerance. Its combination of on-chip resources and family-level hard IP makes it a practical choice for communications, broadcast, compute acceleration, medical imaging, and defense applications.

Backed by the Arria 10 device documentation and configuration features, this device offers a scalable platform for designs that require integration of high-speed interfaces, DSP functions, and flexible reconfiguration while maintaining an emphasis on power efficiency and deployment robustness.

Request a quote or submit a pricing and availability inquiry for part number 10AX027E3F29I2SG to get started with procurement and design planning.

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