10AX027E3F29I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 554 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E3F29I2SG – Arria 10 GX FPGA IC, 270,000 logic elements, 780-BBGA
The 10AX027E3F29I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device built on a 20 nm mid-range architecture. It delivers a balance of high logic density, embedded memory, and advanced I/O suited for performance-sensitive, power-conscious designs.
Targeted at midrange applications across communications, broadcast, computing, medical, and defense markets, this industrial-grade FPGA provides the integration and on-chip resources needed to implement complex datapaths, high-speed interfaces, and flexible system-level functions.
Key Features
- Logic Capacity — 270,000 logic elements for implementing substantial digital logic, state machines, and custom accelerators.
- On-chip Memory — 17,870,848 total RAM bits to support large buffers, packet queues, and embedded data storage without external memory for many functions.
- I/O and High-speed Interfaces — 360 general-purpose I/O pins and support for low-power serial transceivers and enhanced PCS hard IP including 10 Gbps Ethernet and Interlaken, enabling high-bandwidth links and protocol hard IP.
- Hard IP for System Connectivity — Device family documentation includes PCIe Gen1/Gen2/Gen3 hard IP and Ethernet/Interlaken support for common high-speed system interfaces.
- DSP and Clocking — Variable-precision DSP blocks plus comprehensive clock networks, PLL clock sources, and fractional synthesis/I/O PLLs for precise timing and signal processing.
- Configuration and Reliability — Supports dynamic and partial reconfiguration, SEU error detection and correction, and integrated power management features described for the Arria 10 family.
- Package and Mounting — 780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-FBGA, FC (29×29), simplifying high-density board integration.
- Power and Temperature — Core supply voltage range 870 mV–930 mV and industrial operating temperature range −40 °C to 100 °C for extended-environment deployment.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment, where on-chip DSP, transceivers, and logic density enable modem and fronthaul implementations.
- Wireline Networking — 40G/100G muxponders, transponders and line cards that require high-speed serial links, protocol hard IP, and large on-chip buffering.
- Broadcast and Media — Studio switching, signal routing, and video processing applications leveraging abundant logic and embedded memory for real-time media pipelines.
- Computing and Storage Acceleration — Flash cache, server acceleration, and cloud compute offloads that use the device’s logic, memory, and fast I/O to implement custom acceleration engines.
- Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare functions that benefit from high logic capacity, deterministic processing, and industrial temperature range.
Unique Advantages
- High integration density: 270,000 logic elements and 17,870,848 RAM bits enable large, complex designs without excessive external components.
- Robust I/O and protocol support: 360 I/O pins plus hard IP for PCIe and multi-gigabit Ethernet/Interlaken reduce development time for common high-speed interfaces.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environments where thermal resilience is required.
- Advanced signal processing: Variable-precision DSP blocks and flexible clocking PLLs support a wide range of DSP and timing-sensitive functions.
- Compact, board-friendly package: 780-BBGA (780-FBGA, FC 29×29) surface-mount package provides a high-density footprint suitable for space-constrained PCBs.
- Power-aware 20 nm platform: Part of the Arria 10 family engineered for higher performance and improved power efficiency relative to prior mid-range generations.
Why Choose 10AX027E3F29I2SG?
The 10AX027E3F29I2SG Arria 10 GX FPGA is positioned for engineers who need a midrange FPGA with substantial logic and embedded memory, strong I/O capabilities, and industrial temperature tolerance. Its combination of on-chip resources and family-level hard IP makes it a practical choice for communications, broadcast, compute acceleration, medical imaging, and defense applications.
Backed by the Arria 10 device documentation and configuration features, this device offers a scalable platform for designs that require integration of high-speed interfaces, DSP functions, and flexible reconfiguration while maintaining an emphasis on power efficiency and deployment robustness.
Request a quote or submit a pricing and availability inquiry for part number 10AX027E3F29I2SG to get started with procurement and design planning.

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