10AX027E3F29I2LG

The 10AX027E3F29I2LG is an Intel Arria 10 GX FPGA in a 780‑BBGA (FCBGA) package, offering 270,000 logic elements, 17,870,848 bits of on‑chip RAM, and 360 general‑purpose I/O pins. It is a surface‑mount, industrial‑grade device with an operating temperature range of −40 °C to 100 °C and a nominal supply window of 870 mV to 930 mV.

As a member of the Intel Arria 10 family of 20‑nm mid‑range FPGAs, this device targets performance‑ and power‑sensitive midrange applications across communications, broadcast, computing, medical, and defense markets.

Key Features

• Logic Capacity — 270,000 logic elements (cells) to implement complex digital functions and custom accelerators.
• Embedded Memory — 17,870,848 total RAM bits for on‑chip buffering, LUTRAM, and block memory usage.
• I/O Density — 360 I/O pins providing broad connectivity for high‑bandwidth interfaces and multi‑lane designs.
• Package & Mounting — 780‑BBGA, FCBGA package (supplier package: 780‑FBGA, FC 29×29) optimized for high pin count surface‑mount assembly.
• Power Supply — Supported core voltage range from 870 mV to 930 mV to align with system power architectures.
• Industrial Temperature — Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly.
• Arria 10 Family Capabilities — Leverages Arria 10 device heritage including 20‑nm architecture designed for higher performance and power efficiency in midrange FPGA applications.

Typical Applications

• Wireless Infrastructure — Channel processing, switch cards, and remote radio head functions where large logic capacity and on‑chip memory support signal processing workloads.
• Wireline Networking — Line cards, muxponders, and transponder functions that benefit from high I/O count and programmable logic for protocol handling and packet processing.
• Broadcast and Pro AV — Studio switching and media transport that require flexible logic and memory for video frame buffering and format conversion.
• Computing and Storage Acceleration — Server and storage acceleration tasks such as flash cache controllers and cloud compute offload leveraging dense logic and embedded RAM.
• Medical and Defense Systems — Diagnostic imaging, radar, and secure communications applications that require industrial temperature capability and high integration.

Unique Advantages

• High Logic and Memory Density: 270,000 logic elements paired with nearly 18 million bits of on‑chip RAM enable complex algorithms and deep buffering without external RAM for many use cases.
• High I/O Count in a Compact Package: 360 I/Os in a 780‑BBGA FCBGA footprint provide multi‑lane connectivity while conserving board area.
• Industrial Reliability: −40 °C to 100 °C operating range and surface‑mount packaging support deployment in harsh and temperature‑variable environments.
• Power‑Conscious Core Voltage: Core supply range of 870 mV–930 mV aligns with modern low‑voltage system designs to help manage power budgets.
• RoHS Compliance: Lead‑free conformity simplifies regulatory and assembly considerations for commercial products.
• Part of a Proven FPGA Family: Integration within the Arria 10 family delivers access to device documentation and design resources tailored to 20‑nm midrange FPGA designs.

Why Choose 10AX027E3F29I2LG?

The 10AX027E3F29I2LG places substantial programmable logic, abundant embedded memory, and high I/O density into an industrial‑grade FCBGA package—making it suited to midrange, performance‑sensitive designs that must also meet environmental and assembly requirements. Its inclusion in the Intel Arria 10 family means designers can leverage established device documentation and family capabilities when targeting communications, compute acceleration, broadcast, medical, and defense applications.

For engineering teams and procurement, this part offers a balance of integration, thermal tolerance, and configurability appropriate for systems that need on‑device resources to reduce external components and streamline board complexity.

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