10AX027E4F29E3SG

The 10AX027E4F29E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780-ball BGA (FCBGA) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs designed for performance- and power-sensitive applications.

With 270,000 logic elements, 17,870,848 total RAM bits and 360 I/O pins, this extended-grade, surface-mount device targets mid-range systems requiring significant programmable logic, embedded memory and high I/O density in a compact BGA footprint.

Key Features

• Logic Capacity — 270,000 logic elements for substantial programmable logic integration and complex digital designs.
• Embedded Memory — 17,870,848 total RAM bits to support large on-chip data buffering, state storage and memory-mapped functions.
• I/O — 360 user I/O pins to support wide external interfacing and multiple high-pin-count peripherals.
• Package & Mounting — 780-BBGA (FCBGA), 29×29 supplier device package designed for surface-mount assembly.
• Power — Core voltage supply range from 870 mV to 980 mV, enabling integration within specified power domains.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in demanding commercial environments.
• Device Family Context — Part of the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs, with associated device documentation and variants.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Wireless infrastructure — Channel and switch card implementations and mobile backhaul modules that require programmable logic and on-chip memory.
• Wireline communications — Line cards, muxponders and transponders where mid-range FPGA performance and high I/O counts are needed for aggregation and bridging functions.
• Broadcast and professional video — Studio switches and video transport systems benefiting from large embedded memory and substantial logic resources.
• Computing and storage — Server acceleration, flash cache and cloud compute modules that use FPGA logic and RAM for low-latency processing and offload tasks.
• Medical and imaging — Diagnostic and imaging systems that require programmable signal processing and substantial on-chip memory.

Unique Advantages

• High logic density: 270,000 logic elements enable implementation of complex algorithms and sizable programmable systems on a single device.
• Large on-chip memory: 17,870,848 RAM bits reduce external memory dependency and improve data throughput for buffering and caching.
• Ample external connectivity: 360 I/O pins support multiple parallel interfaces and peripheral connections without compromising board-level routing.
• Compact BGA package: 780-ball FCBGA (29×29) package offers a high-pin-count solution in a compact surface-mount form factor.
• Extended operating range: 0 °C to 100 °C grade accommodates a wide span of commercial deployment conditions.
• Part of a scalable family: Being in the Arria 10 family enables design continuity and migration across device variants and packages.

Why Choose 10AX027E4F29E3SG?

The 10AX027E4F29E3SG positions itself for mid-range applications that demand substantial programmable logic, large embedded memory and a high I/O count in a compact BGA package. Its Arria 10 family heritage and documented device resources support engineers building power-sensitive, performance-oriented systems.

This extended-grade FPGA is suited to designers who need on-chip memory capacity, flexible I/O and the integration benefits of a 780-BBGA FCBGA device while operating within the specified voltage and temperature boundaries.

Request a quote or submit an inquiry to discuss availability, pricing and delivery for the 10AX027E4F29E3SG. Our team can provide ordering details and help match this Arria 10 GX device to your project requirements.