10AX027E4F29I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 810 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E4F29I3LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX027E4F29I3LG is an Intel Arria 10 GX series FPGA in a 780-BBGA FCBGA package, designed for mid-range, high-performance, power-sensitive applications. This device combines a high logic capacity and substantial embedded RAM with a broad I/O count and industrial temperature range, making it suitable for demanding communications, compute and imaging applications.
As part of the Arria 10 family, the device leverages the series’ 20 nm architecture and power-efficiency features and aligns with the Arria 10 device overview capabilities such as hard IP blocks, embedded memory, and flexible clocking for system-level integration.
Key Features
- Logic Capacity 270,000 logic elements to implement complex FPGA designs and custom processing pipelines.
- Embedded Memory 17,870,848 total RAM bits for on-chip buffering, state storage, and memory-intensive functions.
- I/O Resources 360 I/O pins to support wide external interfacing and multiple memory or peripheral connections.
- Package & Mounting 780-BBGA FCBGA package, supplier package 780-FBGA, FC (29×29), with surface-mount mounting type for PCB assembly.
- Power Specified core supply range of 870 mV to 980 mV to match system power-rail designs.
- Operating Range Industrial operating temperature range from −40 °C to 100 °C for reliable operation in harsh environments.
- RoHS Compliance RoHS compliant to meet common environmental and assembly requirements.
- Arria 10 Family Capabilities Family-level features documented in the device overview include embedded memory blocks, fractional synthesis and I/O PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where high logic density and embedded memory support signal processing and packet handling.
- Wireline Networking 40G/100G muxponders, transponders and line cards leveraging the device’s I/O and family hard IP support for high-speed protocol interfaces.
- Broadcast and Media Studio switches, videoconferencing and professional audio/video processing that require on-chip RAM and flexible I/O for media pipelines.
- Compute and Storage Flash cache, cloud server acceleration and storage controllers that benefit from the device’s logic capacity and embedded memory.
- Medical Imaging Diagnostic imaging systems that use on-chip logic and memories for real-time data acquisition and preprocessing.
Unique Advantages
- High logic density: 270,000 logic elements provide the capacity to consolidate multiple functions on a single device, reducing board-level complexity.
- Substantial on-chip RAM: 17.87 million bits of embedded memory support large buffers and low-latency data paths without relying solely on external memory.
- Broad I/O support: 360 I/O pins enable flexible interfacing to peripherals, memory devices and high-speed links.
- Industrial operating range: Rated from −40 °C to 100 °C, suitable for deployment in temperature-challenging environments.
- Compact surface-mount package: 780-BBGA (29×29) package provides a high-pin-count implementation in a manufacturable surface-mount form factor.
- Arria 10 family integration: Family-level hard IP (PCIe, Ethernet, serial transceivers) and clocking features simplify system design and reduce development time.
Why Choose 10AX027E4F29I3LG?
The 10AX027E4F29I3LG positions itself for designs that require a balance of high logic capacity, significant embedded memory, and robust I/O in an industrial-grade FPGA. Its Arria 10 family attributes—combined with device-level specifications such as 270,000 logic elements, 17,870,848 RAM bits, 360 I/O, and a 780-BBGA package—make it suitable for mid-range communications, compute acceleration, and imaging systems.
Backed by Intel’s Arria 10 device documentation, this part is appropriate for teams seeking a well-documented FPGA platform with family-level hard IP and clocking features that aid integration and scalability across product generations.
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