10AX027H1F34I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,767 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027H1F34I1SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX027H1F34I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-FCBGA package. It is part of the Arria 10 device family of 20‑nm mid‑range FPGAs, designed for high‑performance, power‑sensitive applications across communications, broadcast, compute, and industrial markets.
This device combines a high logic element count, substantial embedded memory, and broad I/O capability to support complex system designs that require performance, integration, and industrial operating range.
Key Features
- Core Logic 270,000 logic elements to implement wide-ranging programmable logic and custom datapaths.
- Embedded Memory 17,870,848 total RAM bits for on‑chip buffering, caching, and high‑bandwidth local storage.
- I/O Capability 384 general‑purpose I/Os to connect multiple external devices and memory interfaces.
- Series-Level Interfaces Arria 10 GX series documentation highlights support for high‑speed serial transceivers, PCIe Gen1/2/3 hard IP, and enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken (series‑level features documented in the device overview).
- Power and Voltage Designed to operate from a core voltage supply range of 870 mV to 980 mV, reflecting the device’s low‑voltage core requirements.
- Package and Mounting 1152‑FBGA (1152‑FCBGA, 35×35) supplier device package; surface mount for high‑density board designs.
- Operating Range Industrial temperature range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards, remote radio heads and mobile backhaul systems that require programmable logic and on‑chip memory for real‑time signal processing.
- Wireline and Networking Line cards, muxponders and transponders where high logic density and series‑level support for PCIe and high‑speed serial protocols enable packet processing and aggregation.
- Broadcast and Professional AV Studio switches and video transport systems leveraging the device’s I/O count and embedded memory for media buffering and routing.
- Compute and Storage Acceleration Cloud and server acceleration use cases that benefit from high programmable logic capacity and large on‑chip RAM for caching and offload tasks.
Unique Advantages
- High Logic Density: 270,000 logic elements provide the capacity to implement complex algorithms and multi‑function designs on a single device.
- Large On‑Chip Memory: 17,870,848 total RAM bits enable substantial local buffering and reduce dependence on external memory for many workloads.
- Extensive I/O Resources: 384 I/Os support large peripheral and memory interfaces without immediate need for external GPIO expanders.
- Industrial Temperature Specification: −40 °C to 100 °C operating range supports deployment in industrial and temperature‑variable environments.
- Compact, High‑Density Package: 1152‑FCBGA (35×35) package allows integration into space‑constrained PCBs while preserving high pin count.
- Series Ecosystem Features: As an Arria 10 GX family device, it aligns with documented series capabilities such as power‑efficient 20‑nm architecture and advanced I/O/PHY options described in the device overview.
Why Choose 10AX027H1F34I1SG?
10AX027H1F34I1SG positions itself as a high‑capacity, industrial‑grade Arria 10 GX FPGA suitable for mid‑range designs that demand a balance of logic density, on‑chip memory, and extensive I/O. Its specification set supports complex communications, broadcast, and compute acceleration tasks while meeting industrial temperature requirements.
As part of the Intel Arria 10 family, the device benefits from series documentation and device‑level resources for design, configuration, and system integration, helping teams scale designs and maintain long‑term product robustness.
Request a quote or submit an inquiry to get pricing and availability information for 10AX027H1F34I1SG and discuss how this Arria 10 GX FPGA can fit your next design.

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